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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
34-81250-610C

34-81250-610C

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

0 -
34-81250-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
614-41-642-31-012000

614-41-642-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-642-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-642-31-012000

614-91-642-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-642-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
316-93-132-41-008000

316-93-132-41-008000

SOCKET ELEVATED SIP 32POS

Mill-Max Manufacturing Corp.

0 -
316-93-132-41-008000

数据表

316 Tube Active SIP 32 (1 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
550-80-149-15-063101

550-80-149-15-063101

PGA SOLDER TAIL

Preci-Dip

0 -
550-80-149-15-063101

数据表

550 Bulk Active PGA 149 (15 x 15) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
323-93-132-41-001000

323-93-132-41-001000

CONN SOCKET SIP 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
323-93-132-41-001000

数据表

323 Tube Active SIP 32 (1 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-13-324-41-001000

612-13-324-41-001000

SOCKET CARRIER SLDRTL .300 24POS

Mill-Max Manufacturing Corp.

0 -
612-13-324-41-001000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
612-13-424-41-001000

612-13-424-41-001000

SOCKET CARRIER SLDRTL .400 24POS

Mill-Max Manufacturing Corp.

0 -
612-13-424-41-001000

数据表

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
612-13-624-41-001000

612-13-624-41-001000

SOCKET CARRIER SLDRTL .600 24POS

Mill-Max Manufacturing Corp.

0 -
612-13-624-41-001000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
546-87-181-15-051135

546-87-181-15-051135

CONN SOCKET PGA 181POS GOLD

Preci-Dip

0 -
546-87-181-15-051135

数据表

546 Bulk Active PGA 181 (15 x 15) Gold Flash Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
546-87-181-15-051136

546-87-181-15-051136

CONN SOCKET PGA 181POS GOLD

Preci-Dip

0 -
546-87-181-15-051136

数据表

546 Bulk Active PGA 181 (15 x 15) Gold Flash Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
HLS-0614-TT-22

HLS-0614-TT-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0614-TT-22

数据表

HLS Bulk Active SIP 84 (6 x 14) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
28-0508-21

28-0508-21

CONN SOCKET SIP 28POS GOLD

Aries Electronics

0 -
28-0508-21

数据表

508 Bulk Active SIP 28 (1 x 28) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
28-0508-31

28-0508-31

CONN SOCKET SIP 28POS GOLD

Aries Electronics

0 -
28-0508-31

数据表

508 Bulk Active SIP 28 (1 x 28) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
28-1508-21

28-1508-21

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-1508-21

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
28-1508-31

28-1508-31

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-1508-31

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
614-41-642-31-002000

614-41-642-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-642-31-002000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-642-31-002000

614-91-642-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-642-31-002000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICO-640-ZCGG

ICO-640-ZCGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-640-ZCGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
605-93-636-11-480000

605-93-636-11-480000

SOCKET CARRIER LOWPRO .600 36POS

Mill-Max Manufacturing Corp.

0 -
605-93-636-11-480000

数据表

605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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