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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0612-G-H

APH-0612-G-H

APH-0612-G-H

Samtec Inc.

0 -
APH-0612-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1112-G-H

APH-1112-G-H

APH-1112-G-H

Samtec Inc.

0 -
APH-1112-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1212-G-H

APH-1212-G-H

APH-1212-G-H

Samtec Inc.

0 -
APH-1212-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0412-G-H

APH-0412-G-H

APH-0412-G-H

Samtec Inc.

0 -
APH-0412-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1412-G-H

APH-1412-G-H

APH-1412-G-H

Samtec Inc.

0 -
APH-1412-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1712-G-H

APH-1712-G-H

APH-1712-G-H

Samtec Inc.

0 -
APH-1712-G-H

数据表

* - Active - - - - - - - - - - - - - - -
614-41-636-41-001000

614-41-636-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-636-41-001000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-636-41-001000

614-91-636-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-636-41-001000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
517-87-372-19-111111

517-87-372-19-111111

CONN SOCKET PGA 372POS GOLD

Preci-Dip

0 -
517-87-372-19-111111

数据表

517 Bulk Active PGA 372 (19 x 19) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICA-632-ZWGG-2

ICA-632-ZWGG-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-632-ZWGG-2

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
614-87-144-15-081112

614-87-144-15-081112

CONN SOCKET PGA 144POS GOLD

Preci-Dip

0 -
614-87-144-15-081112

数据表

614 Bulk Active PGA 144 (15 x 15) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APA-648-G-J

APA-648-G-J

ADAPTER PLUG

Samtec Inc.

0 -
APA-648-G-J

数据表

APA Tube Active - 48 (2 x 24) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
116-47-636-41-001000

116-47-636-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-636-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
546-83-133-14-002136

546-83-133-14-002136

CONN SOCKET PGA 133POS GOLD

Preci-Dip

0 -
546-83-133-14-002136

数据表

546 Bulk Active PGA 133 (14 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
ICA-640-WGG-2

ICA-640-WGG-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-640-WGG-2

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
22-4503-21

22-4503-21

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
22-4503-21

数据表

503 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
24-0508-21

24-0508-21

CONN SOCKET SIP 24POS GOLD

Aries Electronics

0 -
24-0508-21

数据表

508 Bulk Active SIP 24 (1 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
24-1508-21

24-1508-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-1508-21

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
714-43-159-31-018000

714-43-159-31-018000

CONN SOCKET SIP 59POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-159-31-018000

数据表

714 Bulk Active SIP 59 (1 x 59) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
34-81150-610C

34-81150-610C

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

0 -
34-81150-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
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