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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
24-3551-11

24-3551-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

0 -
24-3551-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
24-3552-11

24-3552-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

0 -
24-3552-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
24-3553-11

24-3553-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

0 -
24-3553-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
24-6551-11

24-6551-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

0 -
24-6551-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
24-6552-11

24-6552-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

0 -
24-6552-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
24-3554-11

24-3554-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

0 -
24-3554-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
210790-4

210790-4

CONN SOCKET PGA 128POS GOLD

TE Connectivity AMP Connectors

0 -
210790-4

数据表

STA Bulk Obsolete PGA 128 (13 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Tin-Lead Thermoplastic, Polyester, Glass Filled 118.1µin (3.00µm) Phosphor Bronze
24-3503-31

24-3503-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-3503-31

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
40-6572-10

40-6572-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

0 -
40-6572-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
APA-648-T-C

APA-648-T-C

ADAPTER PLUG

Samtec Inc.

0 -
APA-648-T-C

数据表

APA Bulk Active - 48 (2 x 24) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
126-93-432-41-001000

126-93-432-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
126-93-432-41-001000

数据表

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-93-632-41-001000

126-93-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
126-93-632-41-001000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-43-432-41-001000

126-43-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-43-432-41-001000

数据表

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-43-632-41-001000

126-43-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-43-632-41-001000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-640-31-002000

614-41-640-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-640-31-002000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-640-31-002000

614-91-640-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-640-31-002000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
517-87-369-18-091111

517-87-369-18-091111

CONN SOCKET PGA 369POS GOLD

Preci-Dip

0 -
517-87-369-18-091111

数据表

517 Bulk Active PGA 369 (18 x 18) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICA-648-ZAGT

ICA-648-ZAGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-648-ZAGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
ICA-648-WGT

ICA-648-WGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-648-WGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
614-41-640-31-007000

614-41-640-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-640-31-007000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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