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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-91-652-41-003000

116-91-652-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-652-41-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
24-0503-21

24-0503-21

CONN SOCKET SIP 24POS GOLD

Aries Electronics

0 -
24-0503-21

数据表

0503 Bulk Active SIP 24 (1 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
24-0503-31

24-0503-31

CONN SOCKET SIP 24POS GOLD

Aries Electronics

0 -
24-0503-31

数据表

0503 Bulk Active SIP 24 (1 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
30-0501-21

30-0501-21

CONN SOCKET SIP 30POS GOLD

Aries Electronics

0 -
30-0501-21

数据表

501 Bulk Active SIP 30 (1 x 30) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
30-0501-31

30-0501-31

CONN SOCKET SIP 30POS GOLD

Aries Electronics

0 -
30-0501-31

数据表

501 Bulk Active SIP 30 (1 x 30) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
39-0501-20

39-0501-20

CONN SOCKET SIP 39POS TIN

Aries Electronics

0 -
39-0501-20

数据表

501 Bulk Active SIP 39 (1 x 39) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
40-6508-20

40-6508-20

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6508-20

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
40-6508-30

40-6508-30

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6508-30

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
299-93-608-10-002000

299-93-608-10-002000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

0 -
299-93-608-10-002000

数据表

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
20-3508-212

20-3508-212

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-3508-212

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
20-3508-312

20-3508-312

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-3508-312

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
116-93-642-41-003000

116-93-642-41-003000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-642-41-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-642-41-003000

116-43-642-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-642-41-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-47-964-41-117000

114-47-964-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
114-47-964-41-117000

数据表

114 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-41-328-41-002000

124-41-328-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-41-328-41-002000

数据表

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-41-428-41-002000

124-41-428-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-41-428-41-002000

数据表

124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-41-628-41-002000

124-41-628-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-41-628-41-002000

数据表

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-91-328-41-002000

124-91-328-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-91-328-41-002000

数据表

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-91-428-41-002000

124-91-428-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-91-428-41-002000

数据表

124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-91-628-41-002000

124-91-628-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-91-628-41-002000

数据表

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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