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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
714-43-158-31-018000

714-43-158-31-018000

CONN SOCKET SIP 58POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-158-31-018000

数据表

714 Bulk Active SIP 58 (1 x 58) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
117-47-668-41-005000

117-47-668-41-005000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
117-47-668-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) Gold Flash Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
546-87-178-18-111135

546-87-178-18-111135

CONN SOCKET PGA 178POS GOLD

Preci-Dip

0 -
546-87-178-18-111135

数据表

546 Bulk Active PGA 178 (18 x 18) Gold Flash Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
117-93-648-41-005000

117-93-648-41-005000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

0 -
117-93-648-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-PGM13009-10

124-PGM13009-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
124-PGM13009-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
550-10-100-15-001101

550-10-100-15-001101

PGA SOLDER TAIL

Preci-Dip

0 -
550-10-100-15-001101

数据表

550 Bulk Active PGA 100 (15 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 10.0µin (0.25µm) Brass
33-0501-21

33-0501-21

CONN SOCKET SIP 33POS GOLD

Aries Electronics

0 -
33-0501-21

数据表

501 Bulk Active SIP 33 (1 x 33) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
35-0501-20

35-0501-20

CONN SOCKET SIP 35POS TIN

Aries Electronics

0 -
35-0501-20

数据表

501 Bulk Active SIP 35 (1 x 35) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
35-0501-30

35-0501-30

CONN SOCKET SIP 35POS TIN

Aries Electronics

0 -
35-0501-30

数据表

501 Bulk Active SIP 35 (1 x 35) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
614-91-640-31-012000

614-91-640-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-640-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
122-13-324-41-001000

122-13-324-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-324-41-001000

数据表

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
122-13-424-41-001000

122-13-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-424-41-001000

数据表

122 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
122-13-624-41-001000

122-13-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-624-41-001000

数据表

122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
APH-0928-T-R

APH-0928-T-R

APH-0928-T-R

Samtec Inc.

0 -
APH-0928-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0728-T-R

APH-0728-T-R

APH-0728-T-R

Samtec Inc.

0 -
APH-0728-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1228-T-R

APH-1228-T-R

APH-1228-T-R

Samtec Inc.

0 -
APH-1228-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0228-T-R

APH-0228-T-R

APH-0228-T-R

Samtec Inc.

0 -
APH-0228-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1628-T-R

APH-1628-T-R

APH-1628-T-R

Samtec Inc.

0 -
APH-1628-T-R

数据表

* - Active - - - - - - - - - - - - - - -
44-6556-30

44-6556-30

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

0 -
44-6556-30

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
44-6556-20

44-6556-20

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

0 -
44-6556-20

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
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