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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0912-G-T

APH-0912-G-T

APH-0912-G-T

Samtec Inc.

0 -
APH-0912-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0412-G-T

APH-0412-G-T

APH-0412-G-T

Samtec Inc.

0 -
APH-0412-G-T

数据表

* - Active - - - - - - - - - - - - - - -
116-41-650-41-003000

116-41-650-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-650-41-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-650-41-003000

116-91-650-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-650-41-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-11-652-41-001000

110-11-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-11-652-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
HLS-0318-T-31

HLS-0318-T-31

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0318-T-31

数据表

HLS Tube Active SIP 54 (3 x 18) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
104-11-636-41-770000

104-11-636-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-636-41-770000

数据表

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
123-13-318-41-001000

123-13-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-318-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
32-3575-10

32-3575-10

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

0 -
32-3575-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
123-11-322-41-001000

123-11-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-11-322-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
123-11-422-41-001000

123-11-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-11-422-41-001000

数据表

123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
27-0508-21

27-0508-21

CONN SOCKET SIP 27POS GOLD

Aries Electronics

0 -
27-0508-21

数据表

508 Bulk Active SIP 27 (1 x 27) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
27-0508-31

27-0508-31

CONN SOCKET SIP 27POS GOLD

Aries Electronics

0 -
27-0508-31

数据表

508 Bulk Active SIP 27 (1 x 27) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
APH-1838-T-H

APH-1838-T-H

APH-1838-T-H

Samtec Inc.

0 -
APH-1838-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0938-T-H

APH-0938-T-H

APH-0938-T-H

Samtec Inc.

0 -
APH-0938-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1038-T-H

APH-1038-T-H

APH-1038-T-H

Samtec Inc.

0 -
APH-1038-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0538-T-H

APH-0538-T-H

APH-0538-T-H

Samtec Inc.

0 -
APH-0538-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1938-T-H

APH-1938-T-H

APH-1938-T-H

Samtec Inc.

0 -
APH-1938-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1538-T-H

APH-1538-T-H

APH-1538-T-H

Samtec Inc.

0 -
APH-1538-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0238-T-H

APH-0238-T-H

APH-0238-T-H

Samtec Inc.

0 -
APH-0238-T-H

数据表

* - Active - - - - - - - - - - - - - - -
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