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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1440-T-T

APH-1440-T-T

APH-1440-T-T

Samtec Inc.

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APH-1440-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1940-T-T

APH-1940-T-T

APH-1940-T-T

Samtec Inc.

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APH-1940-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0540-T-T

APH-0540-T-T

APH-0540-T-T

Samtec Inc.

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APH-0540-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1040-T-T

APH-1040-T-T

APH-1040-T-T

Samtec Inc.

0 -
APH-1040-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0740-T-T

APH-0740-T-T

APH-0740-T-T

Samtec Inc.

0 -
APH-0740-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0240-T-T

APH-0240-T-T

APH-0240-T-T

Samtec Inc.

0 -
APH-0240-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0640-T-T

APH-0640-T-T

APH-0640-T-T

Samtec Inc.

0 -
APH-0640-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1640-T-T

APH-1640-T-T

APH-1640-T-T

Samtec Inc.

0 -
APH-1640-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1140-T-T

APH-1140-T-T

APH-1140-T-T

Samtec Inc.

0 -
APH-1140-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0340-T-T

APH-0340-T-T

APH-0340-T-T

Samtec Inc.

0 -
APH-0340-T-T

数据表

* - Active - - - - - - - - - - - - - - -
24-526-11

24-526-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

0 -
24-526-11

数据表

Lo-PRO®file, 526 Bulk Active DIP, ZIF (ZIP) 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Beryllium Copper
612-41-328-41-004000

612-41-328-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-328-41-004000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-41-428-41-004000

612-41-428-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-428-41-004000

数据表

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-41-628-41-004000

612-41-628-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-628-41-004000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-91-328-41-004000

612-91-328-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-328-41-004000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-91-428-41-004000

612-91-428-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-428-41-004000

数据表

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-91-628-41-004000

612-91-628-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-628-41-004000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-636-31-012000

614-41-636-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-636-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-636-31-012000

614-91-636-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-636-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
546-83-133-14-002135

546-83-133-14-002135

CONN SOCKET PGA 133POS GOLD

Preci-Dip

0 -
546-83-133-14-002135

数据表

546 Bulk Active PGA 133 (14 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
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