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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
117-41-656-41-005000

117-41-656-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
117-41-656-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
117-91-656-41-005000

117-91-656-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
117-91-656-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-47-648-41-007000

116-47-648-41-007000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-648-41-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
121-11-328-41-001000

121-11-328-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
121-11-328-41-001000

数据表

121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
121-11-428-41-001000

121-11-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
121-11-428-41-001000

数据表

121 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
121-11-628-41-001000

121-11-628-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
121-11-628-41-001000

数据表

121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
31-7400-10

31-7400-10

CONN SOCKET SIP 31POS TIN

Aries Electronics

0 -
31-7400-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 31 (1 x 31) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
31-7440-10

31-7440-10

CONN SOCKET SIP 31POS TIN

Aries Electronics

0 -
31-7440-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 31 (1 x 31) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
31-7500-10

31-7500-10

CONN SOCKET SIP 31POS TIN

Aries Electronics

0 -
31-7500-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 31 (1 x 31) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
16-3508-212

16-3508-212

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-3508-212

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
16-3508-312

16-3508-312

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-3508-312

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
114-41-950-41-117000

114-41-950-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-41-950-41-117000

数据表

114 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-91-950-41-117000

114-91-950-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-91-950-41-117000

数据表

114 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0312-G-12

HLS-0312-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0312-G-12

数据表

HLS Tube Active SIP 36 (3 x 12) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
42-6556-30

42-6556-30

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

0 -
42-6556-30

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
42-6556-20

42-6556-20

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

0 -
42-6556-20

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
614-43-432-31-002000

614-43-432-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-432-31-002000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-632-31-002000

614-43-632-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-632-31-002000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-93-432-31-002000

614-93-432-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-93-432-31-002000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-93-632-31-002000

614-93-632-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-93-632-31-002000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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