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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1538-T-T

APH-1538-T-T

APH-1538-T-T

Samtec Inc.

0 -
APH-1538-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1038-T-T

APH-1038-T-T

APH-1038-T-T

Samtec Inc.

0 -
APH-1038-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0638-T-T

APH-0638-T-T

APH-0638-T-T

Samtec Inc.

0 -
APH-0638-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1138-T-T

APH-1138-T-T

APH-1138-T-T

Samtec Inc.

0 -
APH-1138-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0338-T-T

APH-0338-T-T

APH-0338-T-T

Samtec Inc.

0 -
APH-0338-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1238-T-T

APH-1238-T-T

APH-1238-T-T

Samtec Inc.

0 -
APH-1238-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1638-T-T

APH-1638-T-T

APH-1638-T-T

Samtec Inc.

0 -
APH-1638-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0738-T-T

APH-0738-T-T

APH-0738-T-T

Samtec Inc.

0 -
APH-0738-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0238-T-T

APH-0238-T-T

APH-0238-T-T

Samtec Inc.

0 -
APH-0238-T-T

数据表

* - Active - - - - - - - - - - - - - - -
44-3551-10

44-3551-10

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

0 -
44-3551-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
44-3552-10

44-3552-10

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

0 -
44-3552-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
44-3553-10

44-3553-10

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

0 -
44-3553-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
44-3554-10

44-3554-10

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

0 -
44-3554-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
115-93-650-41-003000

115-93-650-41-003000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
115-93-650-41-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-43-650-41-003000

115-43-650-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-650-41-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-41-640-41-007000

116-41-640-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-640-41-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-640-41-007000

116-91-640-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-640-41-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-632-61-001000

110-43-632-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-632-61-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-632-61-001000

110-93-632-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-632-61-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-99-632-61-001000

110-99-632-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-99-632-61-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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