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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
60-9513-10H

60-9513-10H

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

0 -
60-9513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
117-41-428-41-105000

117-41-428-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
117-41-428-41-105000

数据表

117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-636-41-006000

116-93-636-41-006000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-636-41-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-636-41-006000

116-43-636-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-636-41-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
714-43-154-31-018000

714-43-154-31-018000

CONN SOCKET SIP 54POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-154-31-018000

数据表

714 Bulk Active SIP 54 (1 x 54) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
APH-0428-T-T

APH-0428-T-T

APH-0428-T-T

Samtec Inc.

0 -
APH-0428-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0426-T-R

APH-0426-T-R

APH-0426-T-R

Samtec Inc.

0 -
APH-0426-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1828-T-T

APH-1828-T-T

APH-1828-T-T

Samtec Inc.

0 -
APH-1828-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1428-T-T

APH-1428-T-T

APH-1428-T-T

Samtec Inc.

0 -
APH-1428-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0528-T-T

APH-0528-T-T

APH-0528-T-T

Samtec Inc.

0 -
APH-0528-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1028-T-T

APH-1028-T-T

APH-1028-T-T

Samtec Inc.

0 -
APH-1028-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0628-T-T

APH-0628-T-T

APH-0628-T-T

Samtec Inc.

0 -
APH-0628-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0226-T-R

APH-0226-T-R

APH-0226-T-R

Samtec Inc.

0 -
APH-0226-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1326-T-R

APH-1326-T-R

APH-1326-T-R

Samtec Inc.

0 -
APH-1326-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0828-T-T

APH-0828-T-T

APH-0828-T-T

Samtec Inc.

0 -
APH-0828-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1628-T-T

APH-1628-T-T

APH-1628-T-T

Samtec Inc.

0 -
APH-1628-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1126-T-R

APH-1126-T-R

APH-1126-T-R

Samtec Inc.

0 -
APH-1126-T-R

数据表

* - Active - - - - - - - - - - - - - - -
123-13-422-41-801000

123-13-422-41-801000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-422-41-801000

数据表

123 Tube Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
32-6553-11

32-6553-11

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

0 -
32-6553-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Copper
110-41-320-61-001000

110-41-320-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-41-320-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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