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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-43-628-41-008000

116-43-628-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-628-41-008000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-1436-T-H

APH-1436-T-H

APH-1436-T-H

Samtec Inc.

0 -
APH-1436-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1536-T-H

APH-1536-T-H

APH-1536-T-H

Samtec Inc.

0 -
APH-1536-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0336-T-H

APH-0336-T-H

APH-0336-T-H

Samtec Inc.

0 -
APH-0336-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0736-T-H

APH-0736-T-H

APH-0736-T-H

Samtec Inc.

0 -
APH-0736-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0236-T-H

APH-0236-T-H

APH-0236-T-H

Samtec Inc.

0 -
APH-0236-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0636-T-H

APH-0636-T-H

APH-0636-T-H

Samtec Inc.

0 -
APH-0636-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1136-T-H

APH-1136-T-H

APH-1136-T-H

Samtec Inc.

0 -
APH-1136-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1336-T-H

APH-1336-T-H

APH-1336-T-H

Samtec Inc.

0 -
APH-1336-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0436-T-H

APH-0436-T-H

APH-0436-T-H

Samtec Inc.

0 -
APH-0436-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1236-T-H

APH-1236-T-H

APH-1236-T-H

Samtec Inc.

0 -
APH-1236-T-H

数据表

* - Active - - - - - - - - - - - - - - -
34-0501-21

34-0501-21

CONN SOCKET SIP 34POS GOLD

Aries Electronics

0 -
34-0501-21

数据表

501 Bulk Active SIP 34 (1 x 34) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
34-0501-31

34-0501-31

CONN SOCKET SIP 34POS GOLD

Aries Electronics

0 -
34-0501-31

数据表

501 Bulk Active SIP 34 (1 x 34) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
110-43-324-61-001000

110-43-324-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-324-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-624-61-001000

110-43-624-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-624-61-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-99-324-61-001000

110-99-324-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-99-324-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-99-624-61-001000

110-99-624-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-99-624-61-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
48-6511-11

48-6511-11

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

0 -
48-6511-11

数据表

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
126-41-432-41-001000

126-41-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-432-41-001000

数据表

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-41-632-41-001000

126-41-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-632-41-001000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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