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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
299-43-312-10-001000

299-43-312-10-001000

CONN IC DIP SOCKET 12POS GOLD

Mill-Max Manufacturing Corp.

3 -
299-43-312-10-001000

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
28-C182-10

28-C182-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-C182-10

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
110-43-628-41-801000

110-43-628-41-801000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

6 -
110-43-628-41-801000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
12-823-90C

12-823-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2 -
12-823-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
40-6554-10

40-6554-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

0 -
40-6554-10

数据表

55 Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
220-3342-00-0602J

220-3342-00-0602J

CONN IC DIP SOCKET ZIF 20POS GLD

3M

0 -
220-3342-00-0602J

数据表

Textool™ Tube Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
240-1280-00-0602J

240-1280-00-0602J

CONN IC DIP SOCKET ZIF 40POS GLD

3M

0 -
240-1280-00-0602J

数据表

Textool™ Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
169-PRS13001-12

169-PRS13001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1 -
169-PRS13001-12

数据表

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
232-5205-01

232-5205-01

CONN SOCKET QFN 32POS GOLD

3M

0 -
232-5205-01

数据表

Textool™ Bulk Active QFN 32 (4 x 8) Gold - Beryllium Copper Through Hole Closed Frame - Solder - - Gold Polyethersulfone (PES) - Beryllium Copper
A 16-LC-TT

A 16-LC-TT

CONN IC DIP SOCKET 16POS TIN

Assmann WSW Components

0 -
A 16-LC-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
A 28-LC-TR

A 28-LC-TR

CONN IC DIP SOCKET 28POS TIN

Assmann WSW Components

0 -
A 28-LC-TR

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
A 06-LC-TT

A 06-LC-TT

CONN IC DIP SOCKET 6POS TIN

Assmann WSW Components

0 -
A 06-LC-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
D01-9970442

D01-9970442

CONN SOCKET SIP 4POS GOLD

Harwin Inc.

0 -
D01-9970442

数据表

D01-997 Tube Active SIP 4 (1 x 4) Gold Flash Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
AR 24-HZL-TT

AR 24-HZL-TT

CONN IC DIP SOCKET 24POS TIN

Assmann WSW Components

5 -
AR 24-HZL-TT

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
SA163040

SA163040

CONN IC DIP SOCKET 16POS GOLD

On Shore Technology Inc.

0 -
SA163040

数据表

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Thermoplastic, Polyester, Glass Filled 80.0µin (2.03µm) Brass
A-CCS 020-Z-SM

A-CCS 020-Z-SM

CONN SOCKET PLCC 20POS TIN

Assmann WSW Components

0 -
A-CCS 020-Z-SM

数据表

- Tube Active PLCC 20 (4 x 5) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polyamide (PA9T), Nylon 9T, Glass Filled 160.0µin (4.06µm) Phosphor Bronze
PLCC-28-AT

PLCC-28-AT

PLCC 28P THROUGH HOLE

Adam Tech

0 -
PLCC-28-AT

数据表

PLCC Tube Active PLCC 28 (4 x 7) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 80.0µin (2.03µm) Phosphor Bronze
SA246000

SA246000

CONN IC DIP SOCKET 24POS GOLD

On Shore Technology Inc.

7 -
SA246000

数据表

SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester, Glass Filled 200.0µin (5.08µm) Brass
SA243040

SA243040

CONN IC DIP SOCKET 24POS GOLD

On Shore Technology Inc.

0 -
SA243040

数据表

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Thermoplastic, Polyester, Glass Filled 80.0µin (2.03µm) Brass
AR 08-HZW/TN

AR 08-HZW/TN

CONN IC DIP SOCKET 8POS GOLD

Assmann WSW Components

0 -
AR 08-HZW/TN

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
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