富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
299-43-324-10-001000

299-43-324-10-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

85 -
299-43-324-10-001000

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
299-93-324-10-001000

299-93-324-10-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

25 -
299-93-324-10-001000

数据表

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-93-049-07-000001

510-93-049-07-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

6 -
510-93-049-07-000001

数据表

510 Tube Active DIP, 0.1" (2.54mm) Row Spacing 49 (7 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-93-640-41-801000

123-93-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

10 -
123-93-640-41-801000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-43-964-41-001000

123-43-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

86 -
123-43-964-41-001000

数据表

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
44-3572-11

44-3572-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

50 -
44-3572-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
44-3573-11

44-3573-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

47 -
44-3573-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
210-83-308-41-101000

210-83-308-41-101000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

27 -
210-83-308-41-101000

数据表

210 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 300.0µin (7.62µm) Brass Alloy
110-83-308-41-530000

110-83-308-41-530000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

21 -
110-83-308-41-530000

数据表

110 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 300.0µin (7.62µm) Brass Alloy
110-83-316-41-530000

110-83-316-41-530000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

49 -
110-83-316-41-530000

数据表

110 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 300.0µin (7.62µm) Brass Alloy
110-83-318-41-530000

110-83-318-41-530000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

21 -
110-83-318-41-530000

数据表

110 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 300.0µin (7.62µm) Brass Alloy
110-83-628-41-530000

110-83-628-41-530000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

50 -
110-83-628-41-530000

数据表

110 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 300.0µin (7.62µm) Brass Alloy
CAP-002-01-00

CAP-002-01-00

0603 Capacitor Test Socket

MiS Technologies

17 -
CAP-002-01-00

数据表

- Bulk Active - - - - - - - - - - - - - - -
S582-11-898-15-001414

S582-11-898-15-001414

898 POS BGA SOCKET .050

Mill-Max Manufacturing Corp.

3 -
S582-11-898-15-001414

数据表

- Bulk Active - - - - - - - - - - - - - - -
S530-10-898-15-001406

S530-10-898-15-001406

898 POS BGA HEADER .050

Mill-Max Manufacturing Corp.

5 -
S530-10-898-15-001406

数据表

- Bulk Active - - - - - - - - - - - - - - -
108493-0014

108493-0014

DDR Socket, 96 BGA 7.5 mm x 13.1

Ironwood Electronics

25 -
108493-0014

数据表

Grypper Bag Active BGA 96 (9 x 16) - - - - - 0.031" (0.80mm) Solder - - - - - -
108493-0015

108493-0015

DDR Socket, 96 BGA 7.5 mm x 13.1

Ironwood Electronics

25 -
108493-0015

数据表

Grypper Bag Active BGA 96 (9 x 16) - - - - - 0.031" (0.80mm) Solder - - - - - -
107022-0048

107022-0048

DDR Socket, 78 BGA 7.5 mm x 10.6

Ironwood Electronics

23 -
107022-0048

数据表

Grypper Bag Active BGA 78 (6 x 13) - - - - - 0.031" (0.80mm) Solder - - - - - -
108387-0059

108387-0059

Socket-eMMC/UFS, 153 BGA 10.0 mm

Ironwood Electronics

23 -
108387-0059

数据表

- Bag Active BGA 153 (12 x 13) - - - Through Hole - 0.020" (0.50mm) Solder 0.020" (0.50mm) - - - - -
107250-0026

107250-0026

Socket-eMMC/UFS, 153 BGA 11.5 mm

Ironwood Electronics

21 -
107250-0026

数据表

- Bag Active BGA 153 (12 x 13) - - - Through Hole - 0.020" (0.50mm) Solder 0.020" (0.50mm) - - - - -
共 19086 条记录«上一页1... 7071727374757677...955下一页»
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户