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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
XR2T-2021-N

XR2T-2021-N

CONN IC DIP SOCKET 20POS GOLD

Omron Electronics Inc-EMC Div

0 -
XR2T-2021-N

数据表

XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame, Seal Tape 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled Flash Beryllium Copper
XR2A-1625

XR2A-1625

CONN IC DIP SOCKET 16POS GOLD

Omron Electronics Inc-EMC Div

0 -
XR2A-1625

数据表

XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled Flash Beryllium Copper
ICO-316-SGG

ICO-316-SGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-316-SGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
XR2A-0802

XR2A-0802

CONN IC DIP SOCKET 8POS GOLD

Omron Electronics Inc-EMC Div

54 -
XR2A-0802

数据表

XR2 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled 29.5µin (0.75µm) Beryllium Copper
524-AG11D-ES

524-AG11D-ES

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
524-AG11D-ES

数据表

500 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin-Lead Polyester - Copper Alloy
3-1571551-2

3-1571551-2

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

0 -
3-1571551-2

数据表

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold Flash Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Flash Nickel
528-AG12D

528-AG12D

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors

81 -
528-AG12D

数据表

500 Tray Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester - Beryllium Copper
110-13-318-41-801000

110-13-318-41-801000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

80 -
110-13-318-41-801000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
848-AG10D

848-AG10D

CONN IC DIP SOCKET 48POS GOLD

TE Connectivity AMP Connectors

41 -
848-AG10D

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C - Polyester - Copper Alloy
299-93-318-10-001000

299-93-318-10-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

64 -
299-93-318-10-001000

数据表

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
299-43-616-10-002000

299-43-616-10-002000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

84 -
299-43-616-10-002000

数据表

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
117-43-652-41-005000

117-43-652-41-005000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

32 -
117-43-652-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
2043650006

2043650006

P&S Conn 6MM CST SMT SOCKET W/1M

Molex

15 -
2043650006

数据表

* Tray Active - - - - - - - - - - - - - - -
3-1571550-2

3-1571550-2

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

0 -
3-1571550-2

数据表

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 25.0µin (0.63µm) Beryllium Copper
8060-1G9

8060-1G9

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors

0 -
8060-1G9

数据表

8060 Bulk Obsolete Transistor, TO-5 3 (Round) Gold - Beryllium Copper Panel Mount Closed Frame - Solder - -55°C ~ 125°C Gold Polytetrafluoroethylene (PTFE) - Beryllium Copper
2-1437504-6

2-1437504-6

8060-1G9=GOLD TRANSISTOR SOCKE

TE Connectivity AMP Connectors

38 -
2-1437504-6

数据表

8060 Bulk Active Transistor, TO-5 3 (Round) Gold - Beryllium Copper Panel Mount Closed Frame - Solder - -55°C ~ 125°C Gold Polytetrafluoroethylene (PTFE) - Beryllium Copper
110-13-628-41-801000

110-13-628-41-801000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

86 -
110-13-628-41-801000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
2040540-2

2040540-2

CONN SOCKET LGA 1156POS GOLD

TE Connectivity AMP Connectors

0 -
2040540-2

数据表

- Tray Active LGA 1156 (34 x 34) Gold Flash Copper Alloy Surface Mount Closed Frame 0.036" (0.91mm) Solder 0.039" (1.00mm) - - Thermoplastic - Copper Alloy
117-43-664-41-005000

117-43-664-41-005000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

53 -
117-43-664-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APA-324-G-N

APA-324-G-N

ADAPTER PLUG

Samtec Inc.

0 -
APA-324-G-N

数据表

APA Bulk Active - 24 (2 x 12) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
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