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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
614-93-422-31-018000

614-93-422-31-018000

SOCKET CARRIER LOWPRO .400 22POS

Mill-Max Manufacturing Corp.

0 -
614-93-422-31-018000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-322-31-018000

614-43-322-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-322-31-018000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
614-43-422-31-018000

614-43-422-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-422-31-018000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
ICA-648-ZWGT-3

ICA-648-ZWGT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-648-ZWGT-3

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
18-3503-31

18-3503-31

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-3503-31

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
104-13-318-41-780000

104-13-318-41-780000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-318-41-780000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
124-41-316-41-002000

124-41-316-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-41-316-41-002000

数据表

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-91-316-41-002000

124-91-316-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-91-316-41-002000

数据表

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-1024-T-H

APH-1024-T-H

APH-1024-T-H

Samtec Inc.

0 -
APH-1024-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0624-T-H

APH-0624-T-H

APH-0624-T-H

Samtec Inc.

0 -
APH-0624-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1224-T-H

APH-1224-T-H

APH-1224-T-H

Samtec Inc.

0 -
APH-1224-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1824-T-H

APH-1824-T-H

APH-1824-T-H

Samtec Inc.

0 -
APH-1824-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1724-T-H

APH-1724-T-H

APH-1724-T-H

Samtec Inc.

0 -
APH-1724-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0724-T-H

APH-0724-T-H

APH-0724-T-H

Samtec Inc.

0 -
APH-0724-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0824-T-H

APH-0824-T-H

APH-0824-T-H

Samtec Inc.

0 -
APH-0824-T-H

数据表

* - Active - - - - - - - - - - - - - - -
714-93-120-41-001000

714-93-120-41-001000

SOCKET CARRIER SIP 20POS

Mill-Max Manufacturing Corp.

0 -
714-93-120-41-001000

数据表

714 Tube Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-640-ZWGT-2

ICA-640-ZWGT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-640-ZWGT-2

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
28-81000-610C

28-81000-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-81000-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
28-81010-610C

28-81010-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-81010-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
28-81250-610C

28-81250-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-81250-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
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