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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
25-7390-10

25-7390-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

0 -
25-7390-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
25-7435-10

25-7435-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

0 -
25-7435-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
25-7450-10

25-7450-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

0 -
25-7450-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
25-7500-10

25-7500-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

0 -
25-7500-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
25-7590-10

25-7590-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

0 -
25-7590-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
25-7625-10

25-7625-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

0 -
25-7625-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
25-7677-10

25-7677-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

0 -
25-7677-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
25-7700-10

25-7700-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

0 -
25-7700-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
25-7750-10

25-7750-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

0 -
25-7750-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
25-7770-10

25-7770-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

0 -
25-7770-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
25-7787-10

25-7787-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

0 -
25-7787-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
25-7846-10

25-7846-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

0 -
25-7846-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
25-7950-10

25-7950-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

0 -
25-7950-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
612-41-320-41-001000

612-41-320-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-320-41-001000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-41-420-41-001000

612-41-420-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-420-41-001000

数据表

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-91-320-41-001000

612-91-320-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-320-41-001000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-91-420-41-001000

612-91-420-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-420-41-001000

数据表

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-322-31-007000

614-41-322-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-322-31-007000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-422-31-007000

614-41-422-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-422-31-007000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-322-31-007000

614-91-322-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-322-31-007000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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