富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
517-87-299-16-091111

517-87-299-16-091111

CONN SOCKET PGA 299POS GOLD

Preci-Dip

0 -
517-87-299-16-091111

数据表

517 Bulk Active PGA 299 (16 x 16) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
268-5401-50-1102

268-5401-50-1102

3M TEXTOOL OEM LCC SOCKETS 268-5

3M

0 -
268-5401-50-1102

数据表

Textool™ Bulk Obsolete - - - - - - - - - - - - - - -
714-93-120-31-012000

714-93-120-31-012000

SOCKET CARRIER SIP 20POS

Mill-Max Manufacturing Corp.

0 -
714-93-120-31-012000

数据表

714 Tube Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
30-7440-10

30-7440-10

CONN SOCKET SIP 30POS TIN

Aries Electronics

0 -
30-7440-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 30 (1 x 30) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
123-47-424-41-001000

123-47-424-41-001000

STANDARD WIRE WRAP DBL SKT

Mill-Max Manufacturing Corp.

0 -
123-47-424-41-001000

数据表

123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-47-624-41-001000

123-47-624-41-001000

STANDARD WIRE WRAP DBL SKT

Mill-Max Manufacturing Corp.

0 -
123-47-624-41-001000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
26-0501-30

26-0501-30

CONN SOCKET SIP 26POS TIN

Aries Electronics

0 -
26-0501-30

数据表

501 Bulk Active SIP 26 (1 x 26) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
104-13-316-41-770000

104-13-316-41-770000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-316-41-770000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
612-41-316-41-003000

612-41-316-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-316-41-003000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-91-316-41-003000

612-91-316-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-316-41-003000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
546-87-145-15-081135

546-87-145-15-081135

CONN SOCKET PGA 145POS GOLD

Preci-Dip

0 -
546-87-145-15-081135

数据表

546 Bulk Active PGA 145 (15 x 15) Gold Flash Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
HLS-0311-G-31

HLS-0311-G-31

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0311-G-31

数据表

HLS Tube Active SIP 33 (3 x 11) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
40-3513-11H

40-3513-11H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-3513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
714-93-120-31-007000

714-93-120-31-007000

SOCKET CARRIER SIP 20POS

Mill-Max Manufacturing Corp.

0 -
714-93-120-31-007000

数据表

714 Tube Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-93-320-31-018000

614-93-320-31-018000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
614-93-320-31-018000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-93-420-31-018000

614-93-420-31-018000

SOCKET CARRIER LOWPRO .400 20POS

Mill-Max Manufacturing Corp.

0 -
614-93-420-31-018000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-320-31-018000

614-43-320-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-320-31-018000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
614-43-420-31-018000

614-43-420-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-420-31-018000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
3883-312-10-32

3883-312-10-32

SER 6556 UNIV TEST SCKT RECEP

Aries Electronics

0 -
3883-312-10-32

数据表

- - Active - - - - - - - - - - - - - - -
210-43-636-41-001000

210-43-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-43-636-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户