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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-41-420-41-001000

116-41-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-420-41-001000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-320-41-001000

116-91-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-320-41-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-420-41-001000

116-91-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-420-41-001000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-0424-T-T

APH-0424-T-T

APH-0424-T-T

Samtec Inc.

0 -
APH-0424-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1924-T-T

APH-1924-T-T

APH-1924-T-T

Samtec Inc.

0 -
APH-1924-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0924-T-T

APH-0924-T-T

APH-0924-T-T

Samtec Inc.

0 -
APH-0924-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1524-T-T

APH-1524-T-T

APH-1524-T-T

Samtec Inc.

0 -
APH-1524-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0224-T-T

APH-0224-T-T

APH-0224-T-T

Samtec Inc.

0 -
APH-0224-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0324-T-T

APH-0324-T-T

APH-0324-T-T

Samtec Inc.

0 -
APH-0324-T-T

数据表

* - Active - - - - - - - - - - - - - - -
116-93-324-41-003000

116-93-324-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-324-41-003000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-424-41-003000

116-93-424-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-424-41-003000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-624-41-003000

116-93-624-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-624-41-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-324-41-003000

116-43-324-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-324-41-003000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-424-41-003000

116-43-424-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-424-41-003000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-624-41-003000

116-43-624-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-624-41-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-41-316-41-002000

126-41-316-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-316-41-002000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-316-41-002000

126-91-316-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-316-41-002000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
517-87-296-19-131111

517-87-296-19-131111

CONN SOCKET PGA 296POS GOLD

Preci-Dip

0 -
517-87-296-19-131111

数据表

517 Bulk Active PGA 296 (19 x 19) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ASU02DXTB

ASU02DXTB

CONN SOCKET AXIAL 2POS GOLD

Sullins Connector Solutions

0 -
ASU02DXTB

数据表

- Tray Obsolete Axial 2 (Rectangular) Gold 10.0µin (0.25µm) - Through Hole Board Guide - Solder - - Gold - 10.0µin (0.25µm) -
114-41-642-41-117000

114-41-642-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-41-642-41-117000

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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