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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-41-628-41-006000

116-41-628-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-628-41-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-328-41-006000

116-91-328-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-328-41-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-428-41-006000

116-91-428-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-428-41-006000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-628-41-006000

116-91-628-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-628-41-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-318-31-002000

614-41-318-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-318-31-002000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-318-31-002000

614-91-318-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-318-31-002000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-318-31-007000

614-41-318-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-318-31-007000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-318-31-007000

614-91-318-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-318-31-007000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
410-93-214-10-002000

410-93-214-10-002000

SOCKET DUAL IN-LINE SLDRTL 14POS

Mill-Max Manufacturing Corp.

0 -
410-93-214-10-002000

数据表

410 Tube Active Zig-Zag, Right Stackable 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
20-8730-310C

20-8730-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-8730-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
20-8770-310C

20-8770-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-8770-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
126-41-320-41-001000

126-41-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-320-41-001000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-41-420-41-001000

126-41-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-420-41-001000

数据表

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-320-41-001000

126-91-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-320-41-001000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-420-41-001000

126-91-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-420-41-001000

数据表

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICO-640-MGG

ICO-640-MGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-640-MGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
APH-1422-T-H

APH-1422-T-H

APH-1422-T-H

Samtec Inc.

0 -
APH-1422-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0922-T-H

APH-0922-T-H

APH-0922-T-H

Samtec Inc.

0 -
APH-0922-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1022-T-H

APH-1022-T-H

APH-1022-T-H

Samtec Inc.

0 -
APH-1022-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1522-T-H

APH-1522-T-H

APH-1522-T-H

Samtec Inc.

0 -
APH-1522-T-H

数据表

* - Active - - - - - - - - - - - - - - -
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