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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
50-9513-10H

50-9513-10H

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

0 -
50-9513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
110-93-318-41-105000

110-93-318-41-105000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-93-318-41-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-1416-T-T

APH-1416-T-T

APH-1416-T-T

Samtec Inc.

0 -
APH-1416-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0916-T-T

APH-0916-T-T

APH-0916-T-T

Samtec Inc.

0 -
APH-0916-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0516-T-T

APH-0516-T-T

APH-0516-T-T

Samtec Inc.

0 -
APH-0516-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1016-T-T

APH-1016-T-T

APH-1016-T-T

Samtec Inc.

0 -
APH-1016-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1116-T-T

APH-1116-T-T

APH-1116-T-T

Samtec Inc.

0 -
APH-1116-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0316-T-T

APH-0316-T-T

APH-0316-T-T

Samtec Inc.

0 -
APH-0316-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1716-T-T

APH-1716-T-T

APH-1716-T-T

Samtec Inc.

0 -
APH-1716-T-T

数据表

* - Active - - - - - - - - - - - - - - -
28-3503-20

28-3503-20

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-3503-20

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
58-1518-00

58-1518-00

CONN IC DIP SOCKET 58POS GOLD

Aries Electronics

0 -
58-1518-00

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 58 (2 x 29) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
18-81125-610C

18-81125-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-81125-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
317-93-113-41-005000

317-93-113-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
317-93-113-41-005000

数据表

317 Bulk Active SIP 13 (1 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
18-6503-31

18-6503-31

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-6503-31

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
38-0508-20

38-0508-20

CONN SOCKET SIP 38POS GOLD

Aries Electronics

0 -
38-0508-20

数据表

508 Bulk Active SIP 38 (1 x 38) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
38-0508-30

38-0508-30

CONN SOCKET SIP 38POS GOLD

Aries Electronics

0 -
38-0508-30

数据表

508 Bulk Active SIP 38 (1 x 38) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
38-1508-20

38-1508-20

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

0 -
38-1508-20

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
38-1508-30

38-1508-30

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

0 -
38-1508-30

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
317-47-118-41-005000

317-47-118-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.

0 -
317-47-118-41-005000

数据表

317 Bulk Active SIP 18 (1 x 18) Gold Flash Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APA-640-T-P

APA-640-T-P

ADAPTER PLUG

Samtec Inc.

0 -
APA-640-T-P

数据表

APA Tube Active - 40 (2 x 20) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
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