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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
317-43-112-41-005000

317-43-112-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.

0 -
317-43-112-41-005000

数据表

317 Bulk Active SIP 12 (1 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
714-43-140-31-018000

714-43-140-31-018000

CONN SOCKET SIP 40POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-140-31-018000

数据表

714 Bulk Active SIP 40 (1 x 40) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
APA-318-G-A

APA-318-G-A

ADAPTER PLUG

Samtec Inc.

0 -
APA-318-G-A

数据表

APA Bulk Active - 18 (2 x 9) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
210-43-424-41-001000

210-43-424-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-43-424-41-001000

数据表

210 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-93-424-41-001000

210-93-424-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-93-424-41-001000

数据表

210 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
117-47-316-41-005000

117-47-316-41-005000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
117-47-316-41-005000

数据表

117 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
18-822-90E

18-822-90E

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

0 -
18-822-90E

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 50.0µin (1.27µm) Phosphor Bronze
110-41-628-41-605000

110-41-628-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-41-628-41-605000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-91-628-41-605000

110-91-628-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-91-628-41-605000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-310-41-001000

116-93-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-310-41-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-310-41-001000

116-43-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-310-41-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
104-11-210-41-780000

104-11-210-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-210-41-780000

数据表

104 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
110-93-420-41-105000

110-93-420-41-105000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-93-420-41-105000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-420-41-105000

110-43-420-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-420-41-105000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-83-225-18-019101

510-83-225-18-019101

CONN SOCKET PGA 225POS GOLD

Preci-Dip

0 -
510-83-225-18-019101

数据表

510 Bulk Active PGA 225 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-91-422-41-003000

115-91-422-41-003000

SOCKET IC OPEN LOWPRO .400 22POS

Mill-Max Manufacturing Corp.

0 -
115-91-422-41-003000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Thermoplastic 200.0µin (5.08µm) Brass Alloy
115-41-422-41-003000

115-41-422-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-41-422-41-003000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0114-G-3

HLS-0114-G-3

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0114-G-3

数据表

HLS Tube Active SIP 14 (1 x 14) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
21-0501-21

21-0501-21

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0501-21

数据表

501 Bulk Active SIP 21 (1 x 21) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
21-0501-31

21-0501-31

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0501-31

数据表

501 Bulk Active SIP 21 (1 x 21) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
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