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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
20-7550-10

20-7550-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-7550-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-7562-10

20-7562-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-7562-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-7570-10

20-7570-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-7570-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-7625-10

20-7625-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-7625-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-7629-10

20-7629-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-7629-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-7636-10

20-7636-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-7636-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
APA-324-G-A1

APA-324-G-A1

ADAPTER PLUG

Samtec Inc.

0 -
APA-324-G-A1

数据表

APA Bulk Active - 24 (2 x 12) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
APO-324-G-A1

APO-324-G-A1

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-324-G-A1

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
HLS-0614-TT-2

HLS-0614-TT-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0614-TT-2

数据表

HLS Bulk Active SIP 84 (6 x 14) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
111-93-318-41-001000

111-93-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

0 -
111-93-318-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-44-424-41-003000

115-44-424-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-44-424-41-003000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
8058-1G30

8058-1G30

CONN TRANSIST TO-5 4POS GOLD

TE Connectivity AMP Connectors

0 -
8058-1G30

数据表

8058 Bulk Obsolete Transistor, TO-5 4 (Round) Gold - Beryllium Copper Panel Mount Closed Frame - Solder - -55°C ~ 125°C Gold Polytetrafluoroethylene (PTFE) - Brass
146-41-316-41-012000

146-41-316-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-41-316-41-012000

数据表

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
146-91-316-41-012000

146-91-316-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-91-316-41-012000

数据表

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-87-650-41-013101

116-87-650-41-013101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
116-87-650-41-013101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-240-16-001101

510-83-240-16-001101

CONN SOCKET PGA 240POS GOLD

Preci-Dip

0 -
510-83-240-16-001101

数据表

510 Bulk Active PGA 240 (16 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-240-17-061101

510-83-240-17-061101

CONN SOCKET PGA 240POS GOLD

Preci-Dip

0 -
510-83-240-17-061101

数据表

510 Bulk Active PGA 240 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
111-93-420-41-001000

111-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
111-93-420-41-001000

数据表

111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-43-420-41-001000

111-43-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-43-420-41-001000

数据表

111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
232-1271-00-1102JH

232-1271-00-1102JH

OEM LCC SOCKETS 32 POS SOLID LID

3M

0 -
232-1271-00-1102JH

数据表

OEM - Obsolete - - - - - - - - - - - - - - -
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