富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-43-210-41-008000

116-43-210-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-210-41-008000

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-83-236-17-061101

510-83-236-17-061101

CONN SOCKET PGA 236POS GOLD

Preci-Dip

0 -
510-83-236-17-061101

数据表

510 Bulk Active PGA 236 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-236-17-062101

510-83-236-17-062101

CONN SOCKET PGA 236POS GOLD

Preci-Dip

0 -
510-83-236-17-062101

数据表

510 Bulk Active PGA 236 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-43-304-61-001000

110-43-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-304-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
104-11-210-41-770000

104-11-210-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-210-41-770000

数据表

104 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
121-11-310-41-001000

121-11-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
121-11-310-41-001000

数据表

121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
110-43-316-41-605000

110-43-316-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-316-41-605000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-91-306-41-001000

123-91-306-41-001000

SOCKET IC OPEN 3 LVL .300 6POS

Mill-Max Manufacturing Corp.

0 -
123-91-306-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-41-306-41-001000

123-41-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-41-306-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0510-S-2

HLS-0510-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0510-S-2

数据表

HLS Bulk Active SIP 50 (5 x 10) Gold - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
25-71000-10

25-71000-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

0 -
25-71000-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
25-71219-10

25-71219-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

0 -
25-71219-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
25-71220-10

25-71220-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

0 -
25-71220-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
25-7650-10

25-7650-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

0 -
25-7650-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
25-7800-10

25-7800-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

0 -
25-7800-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
18-8465-310C

18-8465-310C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8465-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
115-93-420-41-001000

115-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
115-93-420-41-001000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-43-420-41-001000

115-43-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-420-41-001000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-87-100-10-000112

614-87-100-10-000112

CONN SOCKET PGA 100POS GOLD

Preci-Dip

0 -
614-87-100-10-000112

数据表

614 Bulk Active PGA 100 (10 x 10) Gold Flash Beryllium Copper Through Hole Carrier, Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-87-100-13-062112

614-87-100-13-062112

CONN SOCKET PGA 100POS GOLD

Preci-Dip

0 -
614-87-100-13-062112

数据表

614 Bulk Active PGA 100 (13 x 13) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户