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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
37-0508-30

37-0508-30

CONN SOCKET SIP 37POS GOLD

Aries Electronics

0 -
37-0508-30

数据表

508 Bulk Active SIP 37 (1 x 37) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
18-6621-30

18-6621-30

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

0 -
18-6621-30

数据表

6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
917-41-210-41-001000

917-41-210-41-001000

CONN SKT TRANSISTOR

Mill-Max Manufacturing Corp.

0 -
917-41-210-41-001000

数据表

917 Tube Active Transistor, TO-100 10 (Round) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-47-328-41-003000

115-47-328-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
115-47-328-41-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-99-642-41-001000

110-99-642-41-001000

CONN IC DIP SOCKET 42POS TINLEAD

Mill-Max Manufacturing Corp.

0 -
110-99-642-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-316-10-003000

110-93-316-10-003000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-93-316-10-003000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-93-308-31-018000

614-93-308-31-018000

SOCKET CARRIER LOWPRO .300 8POS

Mill-Max Manufacturing Corp.

0 -
614-93-308-31-018000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-308-31-018000

614-43-308-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-308-31-018000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
ICF-324-STL-I

ICF-324-STL-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-324-STL-I

数据表

ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
ICF-324-STL-O

ICF-324-STL-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-324-STL-O

数据表

ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
26-0501-20

26-0501-20

CONN SOCKET SIP 26POS TIN

Aries Electronics

0 -
26-0501-20

数据表

501 Bulk Active SIP 26 (1 x 26) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
114-41-322-41-117000

114-41-322-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-41-322-41-117000

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-41-422-41-117000

114-41-422-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-41-422-41-117000

数据表

114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-91-322-41-117000

114-91-322-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-91-322-41-117000

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-91-422-41-117000

114-91-422-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-91-422-41-117000

数据表

114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-99-640-41-001000

210-99-640-41-001000

CONN IC DIP SOCKET 40POS TINLEAD

Mill-Max Manufacturing Corp.

0 -
210-99-640-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-44-640-41-001000

210-44-640-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
210-44-640-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-83-652-41-004101

116-83-652-41-004101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
116-83-652-41-004101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
317-43-111-41-005000

317-43-111-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.

0 -
317-43-111-41-005000

数据表

317 Bulk Active SIP 11 (1 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-47-636-41-001000

110-47-636-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
110-47-636-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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