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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-41-314-41-003000

116-41-314-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-314-41-003000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-314-41-003000

116-91-314-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-314-41-003000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-47-320-41-006000

116-47-320-41-006000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
116-47-320-41-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-47-420-41-006000

116-47-420-41-006000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-420-41-006000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
88-PGM13041-10

88-PGM13041-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
88-PGM13041-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
APH-0426-T-T

APH-0426-T-T

APH-0426-T-T

Samtec Inc.

0 -
APH-0426-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0926-T-T

APH-0926-T-T

APH-0926-T-T

Samtec Inc.

0 -
APH-0926-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0626-T-T

APH-0626-T-T

APH-0626-T-T

Samtec Inc.

0 -
APH-0626-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0826-T-T

APH-0826-T-T

APH-0826-T-T

Samtec Inc.

0 -
APH-0826-T-T

数据表

* - Active - - - - - - - - - - - - - - -
115-44-422-41-003000

115-44-422-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-44-422-41-003000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
25-0503-20

25-0503-20

CONN SOCKET SIP 25POS GOLD

Aries Electronics

0 -
25-0503-20

数据表

0503 Bulk Active SIP 25 (1 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
50-9518-10H

50-9518-10H

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

0 -
50-9518-10H

数据表

518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
299-83-640-10-002101

299-83-640-10-002101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
299-83-640-10-002101

数据表

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICO-632-CGT

ICO-632-CGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-632-CGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
HLS-0210-G-32

HLS-0210-G-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0210-G-32

数据表

HLS Tube Active SIP 20 (2 x 10) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
123-47-306-41-001000

123-47-306-41-001000

STANDARD WIRE WRAP DBL SKT

Mill-Max Manufacturing Corp.

0 -
123-47-306-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
16-0503-31

16-0503-31

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0 -
16-0503-31

数据表

0503 Bulk Active SIP 16 (1 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
104-13-310-41-780000

104-13-310-41-780000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-310-41-780000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
ICA-640-WGT

ICA-640-WGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-640-WGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
ICA-640-ZAGT

ICA-640-ZAGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-640-ZAGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
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