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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
126-41-308-41-002000

126-41-308-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-308-41-002000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-308-41-002000

126-91-308-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-308-41-002000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
317-93-111-41-005000

317-93-111-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
317-93-111-41-005000

数据表

317 Bulk Active SIP 11 (1 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-41-310-41-001000

116-41-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-310-41-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-310-41-001000

116-91-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-310-41-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-83-232-17-061101

510-83-232-17-061101

CONN SOCKET PGA 232POS GOLD

Preci-Dip

0 -
510-83-232-17-061101

数据表

510 Bulk Active PGA 232 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
299-99-210-12-001800

299-99-210-12-001800

CONN IC DIP SOCKET 10POS TINLEAD

Mill-Max Manufacturing Corp.

0 -
299-99-210-12-001800

数据表

299 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-11-314-41-001000

210-11-314-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-11-314-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
614-93-310-31-012000

614-93-310-31-012000

SOCKET CARRIER LOWPRO .300 10POS

Mill-Max Manufacturing Corp.

0 -
614-93-310-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-310-31-012000

614-43-310-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-310-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
30-0508-20

30-0508-20

CONN SOCKET SIP 30POS GOLD

Aries Electronics

0 -
30-0508-20

数据表

508 Bulk Active SIP 30 (1 x 30) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
114-93-314-41-117000

114-93-314-41-117000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

0 -
114-93-314-41-117000

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-83-241-18-071101

510-83-241-18-071101

CONN SOCKET PGA 241POS GOLD

Preci-Dip

0 -
510-83-241-18-071101

数据表

510 Bulk Active PGA 241 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-241-18-072101

510-83-241-18-072101

CONN SOCKET PGA 241POS GOLD

Preci-Dip

0 -
510-83-241-18-072101

数据表

510 Bulk Active PGA 241 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
104-13-308-41-780000

104-13-308-41-780000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-308-41-780000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
64-9513-11

64-9513-11

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

0 -
64-9513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
19-0508-21

19-0508-21

CONN SOCKET SIP 19POS GOLD

Aries Electronics

0 -
19-0508-21

数据表

508 Bulk Active SIP 19 (1 x 19) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
19-0508-31

19-0508-31

CONN SOCKET SIP 19POS GOLD

Aries Electronics

0 -
19-0508-31

数据表

508 Bulk Active SIP 19 (1 x 19) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
614-41-308-41-001000

614-41-308-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-308-41-001000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-308-41-001000

614-91-308-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-308-41-001000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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