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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
614-41-308-31-007000

614-41-308-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-308-31-007000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-308-31-007000

614-91-308-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-308-31-007000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-420-41-001000

110-43-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-420-41-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-43-318-41-001000

210-43-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-43-318-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-93-318-41-001000

210-93-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-93-318-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
268-5401-52-1102JH

268-5401-52-1102JH

CONN SOCKET CLCC 68POS GOLD

3M

0 -
268-5401-52-1102JH

数据表

OEM Bulk Obsolete CLCC 68 (4 x 17) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyphenylene Sulfide (PPS), Glass Filled 30.0µin (0.76µm) Beryllium Copper
APH-1406-G-H

APH-1406-G-H

APH-1406-G-H

Samtec Inc.

0 -
APH-1406-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1006-G-H

APH-1006-G-H

APH-1006-G-H

Samtec Inc.

0 -
APH-1006-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0906-G-H

APH-0906-G-H

APH-0906-G-H

Samtec Inc.

0 -
APH-0906-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1506-G-H

APH-1506-G-H

APH-1506-G-H

Samtec Inc.

0 -
APH-1506-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0606-G-H

APH-0606-G-H

APH-0606-G-H

Samtec Inc.

0 -
APH-0606-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1106-G-H

APH-1106-G-H

APH-1106-G-H

Samtec Inc.

0 -
APH-1106-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1606-G-H

APH-1606-G-H

APH-1606-G-H

Samtec Inc.

0 -
APH-1606-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1206-G-H

APH-1206-G-H

APH-1206-G-H

Samtec Inc.

0 -
APH-1206-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0406-G-H

APH-0406-G-H

APH-0406-G-H

Samtec Inc.

0 -
APH-0406-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1706-G-H

APH-1706-G-H

APH-1706-G-H

Samtec Inc.

0 -
APH-1706-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1806-G-H

APH-1806-G-H

APH-1806-G-H

Samtec Inc.

0 -
APH-1806-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0706-G-H

APH-0706-G-H

APH-0706-G-H

Samtec Inc.

0 -
APH-0706-G-H

数据表

* - Active - - - - - - - - - - - - - - -
HLS-0215-G-10

HLS-0215-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0215-G-10

数据表

HLS Tube Active SIP 30 (2 x 15) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
18-6810-90

18-6810-90

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-6810-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
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