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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
36-0508-30

36-0508-30

CONN SOCKET SIP 36POS GOLD

Aries Electronics

0 -
36-0508-30

数据表

508 Bulk Active SIP 36 (1 x 36) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
36-1508-20

36-1508-20

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-1508-20

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
612-93-306-41-001000

612-93-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

0 -
612-93-306-41-001000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-43-306-41-001000

612-43-306-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-43-306-41-001000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-47-310-41-001000

116-47-310-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
116-47-310-41-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-91-322-41-003000

115-91-322-41-003000

SOCKET IC OPEN LOWPRO .300 22POS

Mill-Max Manufacturing Corp.

0 -
115-91-322-41-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Thermoplastic 200.0µin (5.08µm) Brass Alloy
115-41-322-41-003000

115-41-322-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-41-322-41-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-47-322-41-117000

114-47-322-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
114-47-322-41-117000

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-47-422-41-117000

114-47-422-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
114-47-422-41-117000

数据表

114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
18-6501-21

18-6501-21

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-6501-21

数据表

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
18-6501-31

18-6501-31

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-6501-31

数据表

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
28-6823-90T

28-6823-90T

CONN IC DIP SOCKET 28POS TIN

Aries Electronics

0 -
28-6823-90T

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
110-41-324-41-605000

110-41-324-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-41-324-41-605000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-41-624-41-605000

110-41-624-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-41-624-41-605000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-91-324-41-605000

110-91-324-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-91-324-41-605000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-91-624-41-605000

110-91-624-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-91-624-41-605000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
605-43-308-11-480000

605-43-308-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0 -
605-43-308-11-480000

数据表

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-13-314-10-001000

110-13-314-10-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-13-314-10-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7), 4 Loaded Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
714-43-138-31-018000

714-43-138-31-018000

CONN SOCKET SIP 38POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-138-31-018000

数据表

714 Bulk Active SIP 38 (1 x 38) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
317-91-113-41-005000

317-91-113-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
317-91-113-41-005000

数据表

317 Bulk Active SIP 13 (1 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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