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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1924-T-H

APH-1924-T-H

APH-1924-T-H

Samtec Inc.

0 -
APH-1924-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1424-T-H

APH-1424-T-H

APH-1424-T-H

Samtec Inc.

0 -
APH-1424-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1524-T-H

APH-1524-T-H

APH-1524-T-H

Samtec Inc.

0 -
APH-1524-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1124-T-H

APH-1124-T-H

APH-1124-T-H

Samtec Inc.

0 -
APH-1124-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1324-T-H

APH-1324-T-H

APH-1324-T-H

Samtec Inc.

0 -
APH-1324-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0324-T-H

APH-0324-T-H

APH-0324-T-H

Samtec Inc.

0 -
APH-0324-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0224-T-H

APH-0224-T-H

APH-0224-T-H

Samtec Inc.

0 -
APH-0224-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1624-T-H

APH-1624-T-H

APH-1624-T-H

Samtec Inc.

0 -
APH-1624-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0424-T-H

APH-0424-T-H

APH-0424-T-H

Samtec Inc.

0 -
APH-0424-T-H

数据表

* - Active - - - - - - - - - - - - - - -
1-1437508-3

1-1437508-3

CONN TRANSIST TO-5 8POS GOLD

TE Connectivity AMP Connectors

0 -
1-1437508-3

数据表

8058 Bulk Obsolete Transistor, TO-5 8 (Round) Gold - Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Gold Polytetrafluoroethylene (PTFE) - Brass
116-83-650-41-004101

116-83-650-41-004101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
116-83-650-41-004101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
23-7400-10

23-7400-10

CONN SOCKET SIP 23POS TIN

Aries Electronics

0 -
23-7400-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 23 (1 x 23) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
81-PGM09001-10

81-PGM09001-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
81-PGM09001-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
614-41-310-31-012000

614-41-310-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-310-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-310-31-012000

614-91-310-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-310-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-41-322-41-001000

115-41-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-41-322-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-41-422-41-001000

115-41-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-41-422-41-001000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-91-322-41-001000

115-91-322-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

0 -
115-91-322-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-91-422-41-001000

115-91-422-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

0 -
115-91-422-41-001000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-41-210-41-008000

116-41-210-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-210-41-008000

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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