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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
115-47-324-41-003000

115-47-324-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
115-47-324-41-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-47-624-41-003000

115-47-624-41-003000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
115-47-624-41-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0215-T-15

HLS-0215-T-15

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0215-T-15

数据表

HLS Tube Active SIP 30 (2 x 15) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
111-41-316-41-001000

111-41-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-41-316-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-91-316-41-001000

111-91-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-91-316-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-41-320-41-001000

111-41-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-41-320-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-41-420-41-001000

111-41-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-41-420-41-001000

数据表

111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-91-320-41-001000

111-91-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-91-320-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-91-420-41-001000

111-91-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-91-420-41-001000

数据表

111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APO-632-G-J

APO-632-G-J

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-632-G-J

数据表

APO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
510-83-225-17-001101

510-83-225-17-001101

CONN SOCKET PGA 225POS GOLD

Preci-Dip

0 -
510-83-225-17-001101

数据表

510 Bulk Active PGA 225 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-225-17-061101

510-83-225-17-061101

CONN SOCKET PGA 225POS GOLD

Preci-Dip

0 -
510-83-225-17-061101

数据表

510 Bulk Active PGA 225 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-225-15-000101

510-83-225-15-000101

CONN SOCKET PGA 225POS GOLD

Preci-Dip

0 -
510-83-225-15-000101

数据表

510 Bulk Active PGA 225 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
8060-1G5

8060-1G5

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors

0 -
8060-1G5

数据表

8060 Bulk Obsolete Transistor, TO-5 3 (Round) Gold - Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Gold Polytetrafluoroethylene (PTFE) - Beryllium Copper
26-3503-20

26-3503-20

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-3503-20

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
26-3503-30

26-3503-30

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-3503-30

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
APO-422-T-T

APO-422-T-T

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-422-T-T

数据表

* - Active - - - - - - - - - - - - - - -
210-99-632-41-001000

210-99-632-41-001000

CONN IC DIP SOCKET 32POS TINLEAD

Mill-Max Manufacturing Corp.

0 -
210-99-632-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-44-632-41-001000

210-44-632-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
210-44-632-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
317-47-113-41-005000

317-47-113-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.

0 -
317-47-113-41-005000

数据表

317 Bulk Active SIP 13 (1 x 13) Gold Flash Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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