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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
40-6518-11H

40-6518-11H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6518-11H

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
123-47-310-41-001000

123-47-310-41-001000

STANDARD WIRE WRAP DBL SKT

Mill-Max Manufacturing Corp.

0 -
123-47-310-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-47-428-41-001000

110-47-428-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
110-47-428-41-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICO-320-BGG

ICO-320-BGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-320-BGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
ICO-624-JGG

ICO-624-JGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-624-JGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
ICA-324-JGG

ICA-324-JGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-324-JGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
APH-1406-G-T

APH-1406-G-T

APH-1406-G-T

Samtec Inc.

0 -
APH-1406-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1506-G-T

APH-1506-G-T

APH-1506-G-T

Samtec Inc.

0 -
APH-1506-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0606-G-T

APH-0606-G-T

APH-0606-G-T

Samtec Inc.

0 -
APH-0606-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0306-G-T

APH-0306-G-T

APH-0306-G-T

Samtec Inc.

0 -
APH-0306-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1306-G-T

APH-1306-G-T

APH-1306-G-T

Samtec Inc.

0 -
APH-1306-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0406-G-T

APH-0406-G-T

APH-0406-G-T

Samtec Inc.

0 -
APH-0406-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0706-G-T

APH-0706-G-T

APH-0706-G-T

Samtec Inc.

0 -
APH-0706-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1806-G-T

APH-1806-G-T

APH-1806-G-T

Samtec Inc.

0 -
APH-1806-G-T

数据表

* - Active - - - - - - - - - - - - - - -
28-516-11S

28-516-11S

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

0 -
28-516-11S

数据表

516 Bulk Active DIP, ZIF (ZIP) 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Beryllium Copper
ICO-632-AGT

ICO-632-AGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-632-AGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
612-41-306-41-001000

612-41-306-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-306-41-001000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-91-306-41-001000

612-91-306-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-306-41-001000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
30-3513-11H

30-3513-11H

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-3513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
714-43-137-31-018000

714-43-137-31-018000

CONN SOCKET SIP 37POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-137-31-018000

数据表

714 Bulk Active SIP 37 (1 x 37) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
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