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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
13-0501-31

13-0501-31

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0 -
13-0501-31

数据表

501 Bulk Active SIP 13 (1 x 13) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
14-C280-20

14-C280-20

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-C280-20

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
ICA-632-ZAGT

ICA-632-ZAGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-632-ZAGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
ICA-632-WGT

ICA-632-WGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-632-WGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
16-820-90CTL

16-820-90CTL

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-820-90CTL

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
HLS-0207-G-3

HLS-0207-G-3

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0207-G-3

数据表

HLS Tube Active SIP 14 (2 x 7) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
116-41-308-41-008000

116-41-308-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-308-41-008000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-308-41-008000

116-91-308-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-308-41-008000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
24-820-90C

24-820-90C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-820-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
24-822-90C

24-822-90C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-822-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
110-93-314-10-001000

110-93-314-10-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-93-314-10-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7), 4 Loaded Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-1814-T-H

APH-1814-T-H

APH-1814-T-H

Samtec Inc.

0 -
APH-1814-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0914-T-H

APH-0914-T-H

APH-0914-T-H

Samtec Inc.

0 -
APH-0914-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1514-T-H

APH-1514-T-H

APH-1514-T-H

Samtec Inc.

0 -
APH-1514-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1014-T-H

APH-1014-T-H

APH-1014-T-H

Samtec Inc.

0 -
APH-1014-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0614-T-H

APH-0614-T-H

APH-0614-T-H

Samtec Inc.

0 -
APH-0614-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1614-T-H

APH-1614-T-H

APH-1614-T-H

Samtec Inc.

0 -
APH-1614-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0314-T-H

APH-0314-T-H

APH-0314-T-H

Samtec Inc.

0 -
APH-0314-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0714-T-H

APH-0714-T-H

APH-0714-T-H

Samtec Inc.

0 -
APH-0714-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0414-T-H

APH-0414-T-H

APH-0414-T-H

Samtec Inc.

0 -
APH-0414-T-H

数据表

* - Active - - - - - - - - - - - - - - -
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