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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1816-T-T

APH-1816-T-T

APH-1816-T-T

Samtec Inc.

0 -
APH-1816-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1916-T-T

APH-1916-T-T

APH-1916-T-T

Samtec Inc.

0 -
APH-1916-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1516-T-T

APH-1516-T-T

APH-1516-T-T

Samtec Inc.

0 -
APH-1516-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0616-T-T

APH-0616-T-T

APH-0616-T-T

Samtec Inc.

0 -
APH-0616-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0216-T-T

APH-0216-T-T

APH-0216-T-T

Samtec Inc.

0 -
APH-0216-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0816-T-T

APH-0816-T-T

APH-0816-T-T

Samtec Inc.

0 -
APH-0816-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1616-T-T

APH-1616-T-T

APH-1616-T-T

Samtec Inc.

0 -
APH-1616-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0716-T-T

APH-0716-T-T

APH-0716-T-T

Samtec Inc.

0 -
APH-0716-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1216-T-T

APH-1216-T-T

APH-1216-T-T

Samtec Inc.

0 -
APH-1216-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0416-T-T

APH-0416-T-T

APH-0416-T-T

Samtec Inc.

0 -
APH-0416-T-T

数据表

* - Active - - - - - - - - - - - - - - -
HLS-0118-G-32

HLS-0118-G-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0118-G-32

数据表

HLS Tube Active SIP 18 (1 x 18) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
30-6513-10H

30-6513-10H

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-6513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
20-0503-20

20-0503-20

CONN SOCKET SIP 20POS GOLD

Aries Electronics

0 -
20-0503-20

数据表

0503 Bulk Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
HLS-0220-T-22

HLS-0220-T-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0220-T-22

数据表

HLS Tube Active SIP 40 (2 x 20) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
ICO-422-AGG

ICO-422-AGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-422-AGG

数据表

ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
ICO-624-ZLGG

ICO-624-ZLGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-624-ZLGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
714-43-131-31-018000

714-43-131-31-018000

CONN SOCKET SIP 31POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-131-31-018000

数据表

714 Bulk Active SIP 31 (1 x 31) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
30-0508-30

30-0508-30

CONN SOCKET SIP 30POS GOLD

Aries Electronics

0 -
30-0508-30

数据表

508 Bulk Active SIP 30 (1 x 30) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
30-1508-20

30-1508-20

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-1508-20

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
30-1508-30

30-1508-30

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-1508-30

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
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