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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
110-87-650-41-005101

110-87-650-41-005101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
110-87-650-41-005101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICF-308-TM-I-TR

ICF-308-TM-I-TR

.100" SMT SCREW MACHINE DIP SOCK

Samtec Inc.

0 -
ICF-308-TM-I-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
115-83-328-41-003101

115-83-328-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
115-83-328-41-003101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
121-83-318-41-001101

121-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
121-83-318-41-001101

数据表

121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
299-87-608-10-002101

299-87-608-10-002101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
299-87-608-10-002101

数据表

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0205-TT-12

HLS-0205-TT-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0205-TT-12

数据表

HLS Tube Active SIP 10 (2 x 5) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
540-44-068-17-400000

540-44-068-17-400000

CONN SOCKET PLCC 68POS TIN

Mill-Max Manufacturing Corp.

0 -
540-44-068-17-400000

数据表

540 Tube Obsolete PLCC 68 (4 x 17) Tin 150.0µin (3.81µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 150.0µin (3.81µm) Copper Alloy
20-3513-10

20-3513-10

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-3513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
117-83-430-41-005101

117-83-430-41-005101

CONN IC DIP SOCKET 30POS GOLD

Preci-Dip

0 -
117-83-430-41-005101

数据表

117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
2-1437537-1

2-1437537-1

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
2-1437537-1

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C - Polyester - -
116-83-422-41-006101

116-83-422-41-006101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-83-422-41-006101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
4-1571551-5

4-1571551-5

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors

0 -
4-1571551-5

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 25.0µin (0.63µm) Nickel
300-032-050

300-032-050

CONN SOCKET SIP 32POS GOLD

3M

0 -
300-032-050

数据表

300 Box Obsolete SIP 32 (1 x 32) Gold 8.00µin (0.203µm) - Through Hole Closed Frame 0.100" (2.54mm) - 0.100" (2.54mm) - Gold - 8.00µin (0.203µm) -
116-87-322-41-002101

116-87-322-41-002101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-87-322-41-002101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-83-624-41-001101

614-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
614-83-624-41-001101

数据表

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
C9314-02

C9314-02

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
C9314-02

数据表

Lo-PRO®file, C93 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
08-6513-10H

08-6513-10H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-6513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
14-3518-11

14-3518-11

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-3518-11

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
110-83-320-41-105191

110-83-320-41-105191

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
110-83-320-41-105191

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
123-87-324-41-001101

123-87-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
123-87-324-41-001101

数据表

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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