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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
05-0503-20

05-0503-20

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0 -
05-0503-20

数据表

0503 Bulk Active SIP 5 (1 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
05-0503-30

05-0503-30

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0 -
05-0503-30

数据表

0503 Bulk Active SIP 5 (1 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
12-0518-00

12-0518-00

CONN SOCKET SIP 12POS GOLD

Aries Electronics

0 -
12-0518-00

数据表

518 Bulk Active SIP 12 (1 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
17-0518-11

17-0518-11

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
17-0518-11

数据表

518 Bulk Active SIP 17 (1 x 17) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
21-0518-10H

21-0518-10H

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0518-10H

数据表

518 Bulk Active SIP 21 (1 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
06-0508-20

06-0508-20

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
06-0508-20

数据表

508 Bulk Active SIP 6 (1 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
06-0508-30

06-0508-30

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
06-0508-30

数据表

508 Bulk Active SIP 6 (1 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
06-1508-20

06-1508-20

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-1508-20

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
06-1508-30

06-1508-30

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-1508-30

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
116-83-420-41-006101

116-83-420-41-006101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-83-420-41-006101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-328-41-005101

110-83-328-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-83-328-41-005101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-87-640-41-001101

115-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
115-87-640-41-001101

数据表

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-320-41-002101

116-87-320-41-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-87-320-41-002101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICF-308-F-O

ICF-308-F-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-308-F-O

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
ICF-308-F-I

ICF-308-F-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-308-F-I

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
114-83-424-41-117101

114-83-424-41-117101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
114-83-424-41-117101

数据表

114 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0106-T-10

HLS-0106-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0106-T-10

数据表

HLS Tube Active SIP 6 (1 x 6) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
116-87-318-41-002101

116-87-318-41-002101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
116-87-318-41-002101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-316-41-007101

116-83-316-41-007101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
116-83-316-41-007101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-428-41-005101

110-83-428-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-83-428-41-005101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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