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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
AR 52-HZL/01-TT

AR 52-HZL/01-TT

SOCKET

Assmann WSW Components

0 -
AR 52-HZL/01-TT

数据表

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 200.0µin (5.08µm) Brass
BU220Z-178-HT

BU220Z-178-HT

CONN IC DIP SOCKET 22POS GOLD

On Shore Technology Inc.

0 -
BU220Z-178-HT

数据表

BU-178HT Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Copper Polybutylene Terephthalate (PBT), Glass Filled Flash Brass
AR 64-HZL-TT

AR 64-HZL-TT

CONN IC DIP SOCKET 64POS TIN

Assmann WSW Components

0 -
AR 64-HZL-TT

数据表

- Tray Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
ICF-314-TM-O

ICF-314-TM-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-314-TM-O

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
ICF-314-T-I

ICF-314-T-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-314-T-I

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
4620

4620

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics

0 -
4620

数据表

- Bulk Obsolete Transistor, TO-3 3 (Rectangular) Tin - Brass Chassis Mount Closed Frame - Solder - - Tin Polyester, Glass Filled - Brass
540-44-044-24-000000

540-44-044-24-000000

CONN SOCKET PLCC 44POS TIN

Mill-Max Manufacturing Corp.

0 -
540-44-044-24-000000

数据表

540 Tube Obsolete PLCC 44 (4 x 11) Tin 150.0µin (3.81µm) Copper Alloy Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 150.0µin (3.81µm) Copper Alloy
06-6513-10H

06-6513-10H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-6513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
11-0513-11

11-0513-11

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0 -
11-0513-11

数据表

0513 Bulk Active SIP 11 (1 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
23-0518-10T

23-0518-10T

CONN SOCKET SIP 23POS GOLD

Aries Electronics

0 -
23-0518-10T

数据表

518 Bulk Active SIP 23 (1 x 23) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
212-1-16-003

212-1-16-003

CONN IC DIP SOCKET 16POS GOLD

CNC Tech

0 -
212-1-16-003

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
HLS-0114-TT-2

HLS-0114-TT-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0114-TT-2

数据表

HLS Tube Active SIP 14 (1 x 14) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
614-87-432-41-001101

614-87-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
614-87-432-41-001101

数据表

614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
299-87-310-11-001101

299-87-310-11-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
299-87-310-11-001101

数据表

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-83-328-41-001101

115-83-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
115-83-328-41-001101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
122-87-320-41-001101

122-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
122-87-320-41-001101

数据表

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
123-87-422-41-001101

123-87-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
123-87-422-41-001101

数据表

123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APO-314-T-J

APO-314-T-J

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-314-T-J

数据表

APO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
D0818-01

D0818-01

CONN IC DIP SOCKET 18POS GOLD

Harwin Inc.

0 -
D0818-01

数据表

D0 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
SMPX-68LCC-P

SMPX-68LCC-P

SMT PLCC SOCKET 68P POLARISED RO

Kycon, Inc.

0 -
SMPX-68LCC-P

数据表

SMPX Tube Active PLCC 68 (4 x 17) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -50°C ~ 105°C Tin Thermoplastic, Glass Filled - Phosphor Bronze
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