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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
14-0518-10H

14-0518-10H

CONN SOCKET SIP 14POS GOLD

Aries Electronics

0 -
14-0518-10H

数据表

518 Bulk Active SIP 14 (1 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
14-1518-10H

14-1518-10H

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-1518-10H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
15-0518-10T

15-0518-10T

CONN SOCKET SIP 15POS GOLD

Aries Electronics

0 -
15-0518-10T

数据表

518 Bulk Active SIP 15 (1 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
04-0508-20

04-0508-20

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0508-20

数据表

508 Bulk Active SIP 4 (1 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
04-1508-20

04-1508-20

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

0 -
04-1508-20

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
116-87-316-41-012101

116-87-316-41-012101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
116-87-316-41-012101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
410-87-224-10-001101

410-87-224-10-001101

CONN ZIG-ZAG 24POS GOLD

Preci-Dip

0 -
410-87-224-10-001101

数据表

410 Bulk Active Zig-Zag, Left Stackable 24 (2 x 12) Gold Flash Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
540-99-068-24-000000

540-99-068-24-000000

CONN SOCKET PLCC 68POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
540-99-068-24-000000

数据表

540 Tube Obsolete PLCC 68 (4 x 17) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) -
1-1814640-7

1-1814640-7

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
1-1814640-7

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 5.00µin (0.127µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic, Polyester 5.00µin (0.127µm) Brass
HLS-0202-G-2

HLS-0202-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0202-G-2

数据表

HLS Tube Active SIP 4 (2 x 2) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
ICF-308-TL-I-TR

ICF-308-TL-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-308-TL-I-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
ICF-308-STL-I-TR

ICF-308-STL-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-308-STL-I-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
AR 40 HGL-TT

AR 40 HGL-TT

SOCKET

Assmann WSW Components

0 -
AR 40 HGL-TT

数据表

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Polybutylene Terephthalate (PBT), Glass Filled Flash Brass
ICF-308-TL-O-TR

ICF-308-TL-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-308-TL-O-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
ICF-308-STL-O-TR

ICF-308-STL-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-308-STL-O-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
BU14OZ-178-HT

BU14OZ-178-HT

CONN IC DIP SOCKET 14POS GOLD

On Shore Technology Inc.

0 -
BU14OZ-178-HT

数据表

BU-178HT Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Copper Polybutylene Terephthalate (PBT), Glass Filled Flash Brass
110-83-314-41-105101

110-83-314-41-105101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
110-83-314-41-105101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-210-41-009101

116-83-210-41-009101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-210-41-009101

数据表

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-310-41-009101

116-83-310-41-009101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-310-41-009101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-322-41-105101

110-87-322-41-105101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
110-87-322-41-105101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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