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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
115-87-328-41-001101

115-87-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
115-87-328-41-001101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
24-3518-10T

24-3518-10T

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-3518-10T

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
917-87-108-41-005101

917-87-108-41-005101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

0 -
917-87-108-41-005101

数据表

917 Bulk Active Transistor, TO-5 8 (Round) Gold Flash Beryllium Copper Through Hole - - Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
917-87-208-41-005101

917-87-208-41-005101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

0 -
917-87-208-41-005101

数据表

917 Bulk Active Transistor, TO-5 8 (Round) Gold Flash Beryllium Copper Through Hole - - Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-87-318-31-012101

614-87-318-31-012101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
614-87-318-31-012101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-314-41-007101

116-87-314-41-007101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
116-87-314-41-007101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
A 28-LC-TR01

A 28-LC-TR01

28 (2 X 14) POS DIP, 0.3" (7.62M

Assmann WSW Components

0 -
A 28-LC-TR01

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
08-6513-11

08-6513-11

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-6513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
A-ICS-254-10-TT50

A-ICS-254-10-TT50

IC SOCKET, MACHINED PIN, 7.62MM,

Assmann WSW Components

0 -
A-ICS-254-10-TT50

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 78.7µin (2.00µm) Brass
08-3518-10H

08-3518-10H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-3518-10H

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
D01-9950942

D01-9950942

CONN SOCKET SIP 9POS GOLD

Harwin Inc.

0 -
D01-9950942

数据表

D01-995 Tube Obsolete SIP 9 (1 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
02-6513-10

02-6513-10

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

0 -
02-6513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
110-87-320-41-105161

110-87-320-41-105161

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
110-87-320-41-105161

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
D0814-01

D0814-01

CONN IC DIP SOCKET 14POS GOLD

Harwin Inc.

0 -
D0814-01

数据表

D0 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
114-87-324-41-117101

114-87-324-41-117101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
114-87-324-41-117101

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-432-41-005101

110-87-432-41-005101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
110-87-432-41-005101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-87-428-41-001101

115-87-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
115-87-428-41-001101

数据表

115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-610-41-011101

116-87-610-41-011101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-610-41-011101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-306-41-013101

116-87-306-41-013101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-87-306-41-013101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
11-0518-11

11-0518-11

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0 -
11-0518-11

数据表

518 Bulk Active SIP 11 (1 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
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