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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
110-83-318-41-605101

110-83-318-41-605101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
110-83-318-41-605101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
121-83-310-41-001101

121-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
121-83-310-41-001101

数据表

121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
130-024-050

130-024-050

CONN IC DIP SOCKET 24POS GOLD

3M

0 -
130-024-050

数据表

100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Gold Polyphenylene Sulfide (PPS), Glass Filled Flash Brass
110-83-320-41-001151

110-83-320-41-001151

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
110-83-320-41-001151

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
114-83-314-41-134191

114-83-314-41-134191

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
114-83-314-41-134191

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
05-0513-11

05-0513-11

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0 -
05-0513-11

数据表

0513 Bulk Active SIP 5 (1 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
SIP050-1X16-160B

SIP050-1X16-160B

1X16-160B-SIP SOCKET 16 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X16-160B

数据表

SIP050-1x Bulk Active SIP 16 (1 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
917-87-108-41-053101

917-87-108-41-053101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

0 -
917-87-108-41-053101

数据表

917 Bulk Active Transistor, TO-5 8 (Round) Gold Flash Beryllium Copper Through Hole - - Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
917-87-208-41-053101

917-87-208-41-053101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

0 -
917-87-208-41-053101

数据表

917 Bulk Active Transistor, TO-5 8 (Round) Gold Flash Beryllium Copper Through Hole - - Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR 64-HGL-TT

AR 64-HGL-TT

SOCKET

Assmann WSW Components

0 -
AR 64-HGL-TT

数据表

AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Polybutylene Terephthalate (PBT), Glass Filled Flash Brass
814-AG11D-ES

814-AG11D-ES

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
814-AG11D-ES

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin-Lead Polyester 80.0µin (2.03µm) Copper Alloy
410-83-216-10-001101

410-83-216-10-001101

CONN ZIG-ZAG 16POS GOLD

Preci-Dip

0 -
410-83-216-10-001101

数据表

410 Bulk Active Zig-Zag, Left Stackable 16 (2 x 8) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
410-83-216-10-002101

410-83-216-10-002101

CONN ZIG-ZAG 16POS GOLD

Preci-Dip

0 -
410-83-216-10-002101

数据表

410 Bulk Active Zig-Zag, Right Stackable 16 (2 x 8) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
11-0513-10

11-0513-10

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0 -
11-0513-10

数据表

0513 Bulk Active SIP 11 (1 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
12-0513-10T

12-0513-10T

CONN SOCKET SIP 12POS GOLD

Aries Electronics

0 -
12-0513-10T

数据表

0513 Bulk Active SIP 12 (1 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
02-0503-21

02-0503-21

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
02-0503-21

数据表

0503 Bulk Active SIP 2 (1 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
02-0503-31

02-0503-31

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
02-0503-31

数据表

0503 Bulk Active SIP 2 (1 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
06-0518-11H

06-0518-11H

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
06-0518-11H

数据表

518 Bulk Active SIP 6 (1 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
06-1518-11H

06-1518-11H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-1518-11H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
13-0518-10H

13-0518-10H

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0 -
13-0518-10H

数据表

518 Bulk Active SIP 13 (1 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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