| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 | 电压 - 电源 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MPF5023CMBA0ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
490 | - |
|
数据表 |
- | 40-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | 200µA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) | 2.5V ~ 5.5V |
|
MC33FS6525CAESYSTEM BASIS CHIP, DCDC 2.2A VCO NXP USA Inc. |
250 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MFS2633AMBA0ADSAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
239 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tray | Active | - | 29µA | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) | 3.2V ~ 40V |
|
MPF5030BMBA0ESPMIC 3 BUCKS 2 LDO A1 DIE NXP USA Inc. |
243 | - |
|
数据表 |
- | 40-PowerVFQFN | Tray | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) | 3.3V ~ 5.25V |
|
MC33FS6515NAESYSTEM BASIS CHIP, DCDC 1.5A VCO NXP USA Inc. |
250 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MC33FS6510NAESYSTEM BASIS CHIP DCDC 1.5A VCO NXP USA Inc. |
250 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MFS2613AMDDCADSAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
230 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tray | Active | - | - | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) | 3.2V ~ 40V |
|
MFS2613AMDA6ADSAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
150 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tray | Active | - | - | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) | 3.2V ~ 40V |
|
MPF7100BVMA1ESPF7100 PMIC I.MX8XL NXP USA Inc. |
260 | - |
|
数据表 |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | 10µA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | 2.5V ~ 5.5V |
|
MC33FS6520NAESYSTEM BASIS CHIP DCDC 2.2A VCO NXP USA Inc. |
250 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |