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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 工作温度 等级 认证 安装类型 供应商设备封装 电压 - 电源
MC33FS6525NAE

MC33FS6525NAE

SYSTEM BASIS CHIP, DCDC 2.2A VCO

NXP USA Inc.

250 -
MC33FS6525NAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC33FS6500CAE

MC33FS6500CAE

SYSTEM BASIS CHIP DCDC 0.8A VCO

NXP USA Inc.

250 -
MC33FS6500CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MPF5024CMBA0ES

MPF5024CMBA0ES

POWER MANAGEMENT IC, PRE-PROG, 4

NXP USA Inc.

490 -
MPF5024CMBA0ES

数据表

- 40-VFQFN Exposed Pad Tray Active High Performance i.MX 8 Processor Based - -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6) 2.5V ~ 5.5V
MC33FS4500LAE

MC33FS4500LAE

SYSTEM BASIS CHIP LINEAR 0.5A V

NXP USA Inc.

250 -
MC33FS4500LAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC33FS4505CAE

MC33FS4505CAE

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

240 -
MC33FS4505CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC33FS6500LAE

MC33FS6500LAE

SYSTEM BASIS CHIP DCDC 0.8A VCO

NXP USA Inc.

250 -
MC33FS6500LAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC33FS6505CAE

MC33FS6505CAE

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

250 -
MC33FS6505CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC35FS6505NAE

MC35FS6505NAE

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

250 -
MC35FS6505NAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC33FS4505LAE

MC33FS4505LAE

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

250 -
MC33FS4505LAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC33FS6510LAE

MC33FS6510LAE

SYSTEM BASIS CHIP DCDC 1.5A VCO

NXP USA Inc.

250 -
MC33FS6510LAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7) 1V ~ 5V
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