| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 | 电压 - 电源 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC32PF1550A0EPPOWER MANAGEMENT IC: 3 BUCK REGS NXP USA Inc. |
440 | - |
|
数据表 |
- | 40-VFQFN Exposed Pad | Tray | Active | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | -40°C ~ 85°C | - | - | Surface Mount | 40-HVQFN (5x5) | 3.8V ~ 7V |
|
MPF5023AMBA0ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
490 | - |
|
数据表 |
- | 40-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | 10µA | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 40-HVQFN (6x6) | 2.5V ~ 5.5V |
|
MFS2401AVBA0ESMFS2401AVBA0ES NXP USA Inc. |
490 | - |
|
数据表 |
- | 32-VFQFN Exposed Pad | Bulk | Active | System Basis Chip | - | -40°C ~ 115°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 32-HVQFN (5x5) | 5.5V ~ 40V |
|
MFS2401AVBA1ESSafety Mini CAN FD SBC NXP USA Inc. |
135 | - |
|
数据表 |
- | 32-VFQFN Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 115°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 32-HVQFN (5x5) | 5.5V ~ 40V |
|
MC34PF1550A0EPPOWER MANAGEMENT IC 3 BUCK REGS NXP USA Inc. |
490 | - |
|
数据表 |
- | 40-VFQFN Exposed Pad | Tray | Active | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | -40°C ~ 105°C | - | - | Surface Mount | 40-HVQFN (5x5) | 3.8V ~ 7V |
|
MC34PF1550A1EPPOWER MANAGEMENT IC: 3 BUCK REGS NXP USA Inc. |
490 | - |
|
数据表 |
- | 40-VFQFN Exposed Pad | Tray | Active | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | -40°C ~ 105°C | - | - | Surface Mount | 40-HVQFN (5x5) | 3.8V ~ 7V |
|
MC34PF1550A2EPPOWER MANAGEMENT IC: 3 BUCK REGS NXP USA Inc. |
490 | - |
|
数据表 |
- | 40-VFQFN Exposed Pad | Tray | Active | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | -40°C ~ 105°C | - | - | Surface Mount | 40-HVQFN (5x5) | 3.8V ~ 7V |
|
MC34PF1550A3EPPOWER MANAGEMENT IC: 3 BUCK REGS NXP USA Inc. |
490 | - |
|
数据表 |
- | 40-VFQFN Exposed Pad | Tray | Active | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | -40°C ~ 105°C | - | - | Surface Mount | 40-HVQFN (5x5) | 3.8V ~ 7V |
|
MFS2320BMBA0EPMFS2320BMBA0EP NXP USA Inc. |
255 | - |
|
数据表 |
- | 48-VFQFN Exposed Pad | Tray | Active | System Basis Chip | 30µA | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | 5.5V ~ 40V |
|
MC33FS4500NAESYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc. |
250 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |