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制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
374124B60023G

374124B60023G

374124B60023G

Boyd Laconia, LLC

0 -
374124B60023G

数据表

- Bulk Active Top Mount BGA Square, Pin Fins 0.906" (23.00mm) 0.906" (23.00mm) - 0.709" (18.00mm) Thermal Tape, Adhesive (Included) 1.0W @ 30°C 7.40°C/W @ 200 LFM 23.40°C/W Aluminum Black Anodized
2342B

2342B

HEAT SINK

Boyd Laconia, LLC

0 -
2342B

数据表

- Bulk Active Top Mount BGA Rectangular, Pin Fins 1.756" (44.60mm) 1.799" (45.70mm) - 0.275" (7.00mm) Thermal Tape, Adhesive (Included) - 7.26°C/W @ 200 LFM 23.10°C/W Ceramic Black Anodized
508222B00000

508222B00000

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
508222B00000

数据表

- Bulk Active Board Level TO-220 (Dual) Rectangular, Fins 1.780" (45.21mm) 1.780" (45.21mm) - 1.000" (25.40mm) Bolt On 9.0W @ 50°C 1.00°C/W @ 900 LFM 7.40°C/W Aluminum Black Anodized
PF433G

PF433G

MRP/PF433 HEATSINK

Boyd Laconia, LLC

0 -
PF433G

数据表

- Bulk Active Board Level TO-220, TO-262 Rectangular, Fins 0.767" (19.50mm) 0.500" (12.70mm) - 0.512" (13.00mm) PC Pin 2.5W @ 60°C 7.00°C/W @ 500 LFM 20.30°C/W Aluminum Black Anodized
7038BG

7038BG

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
7038BG

数据表

- Bulk Active Board Level Multiwatt, SIP Rectangular, Fins 0.620" (15.75mm) 0.915" (23.24mm) - 0.380" (9.65mm) Clip 1.5W @ 40°C 6.00°C/W @ 600 LFM 16.00°C/W Aluminum Black Anodized
502403B00000

502403B00000

HEAT SINK 12W 1.25"H SPACE SAVER

Boyd Laconia, LLC

0 -
502403B00000

数据表

- Bag Not For New Designs Board Level - Rhombus 1.630" (41.40mm) 1.290" (32.77mm) - 1.250" (31.75mm) Bolt On - - - Aluminum Black Anodized
KU-SMK-0498-ES-ST-0,8MM-3-L

KU-SMK-0498-ES-ST-0,8MM-3-L

KU-SMK-0498-ES-ST-0,8MM-3-L

Boyd Laconia, LLC

0 -
KU-SMK-0498-ES-ST-0,8MM-3-L

数据表

- Bulk Active - - - - - - - - - - - - -
10-6327-02G

10-6327-02G

10-6327-02G

Boyd Laconia, LLC

0 -
10-6327-02G

数据表

- Bulk Active - - - - - - - - - - - - -
SW38-4G

SW38-4G

HTSK-AL-000SW-38-BG (SW38-4G ZA3

Boyd Laconia, LLC

0 -
SW38-4G

数据表

- Bulk Active Board Level, Extrusion TO-218, TO-220, TO-247 Rectangular, Fins 1.496" (38.00mm) 1.359" (34.50mm) - 0.492" (12.50mm) Bolt On and PC Pin 4.0W @ 50°C 6.00°C/W @ 200 LFM 10.20°C/W Aluminum Black Anodized
6399B-P2G

6399B-P2G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
6399B-P2G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 2.000" (50.80mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin 8.0W @ 40°C 1.00°C/W @ 700 LFM 3.30°C/W Aluminum Black Anodized
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