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制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
637302F00000G

637302F00000G

63730 EXTRUSION 2.25X2.996"X4'

Boyd Laconia, LLC

30 -
637302F00000G

数据表

- Box Active Top Mount, Extrusion - Rectangular, Pin Fins 48.000" (1219.20mm) 3.000" (76.20mm) - 2.250" (57.15mm) Adhesive - 1.00°C/W @ 200 LFM - Aluminum -
780102F00000G

780102F00000G

78010 EXTRUSION 2.95X1.34"X4.1'

Boyd Laconia, LLC

143 -
780102F00000G

数据表

- Box Active Board Level, Vertical, Extrusion - Rectangular, Pin Fins 49.500" (1257.30mm) 1.339" (34.00mm) - 2.953" (75.00mm) PC Pin - - - Aluminum -
575102B00000G

575102B00000G

HEATSINK TO-220 CLIP-ON BLK

Boyd Laconia, LLC

2,564 -
575102B00000G

数据表

- Bag Active Board Level TO-220 Rectangular, Fins 0.750" (19.05mm) 1.120" (28.45mm) - 0.440" (11.18mm) Clip 1.0W @ 20°C 6.00°C/W @ 400 LFM 16.80°C/W Aluminum Black Anodized
563202D00000G

563202D00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

2,732 -
563202D00000G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 2.000" (50.80mm) 1.380" (35.05mm) - 0.500" (12.70mm) Bolt On and PC Pin 2.0W @ 30°C 5.00°C/W @ 200 LFM 9.40°C/W - Tin
6221BG

6221BG

THM,16555B REV D-G

Boyd Laconia, LLC

2,929 -
6221BG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) Bolt On and PC Pin - - - Aluminum Black Anodized
PF720

PF720

MRP/PF-720

Boyd Laconia, LLC

870 -
PF720

数据表

- Bulk Active Board Level TO-220 Rectangular 0.787" (20.00mm) 0.776" (19.70mm) - 0.319" (8.10mm) Clip and PC Pin, Bolt On - - 28.90°C/W - Black Paint
6230DG (COPPER)

6230DG (COPPER)

HEATSINK COPPER TO-220 W/TABS

Boyd Laconia, LLC

1,306 -
6230DG (COPPER)

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) Bolt On and PC Pin 1.0W @ 20°C 6.00°C/W @ 300 LFM 12.50°C/W Copper Tin
501603B00000G

501603B00000G

HEAT SINK TO-3 1.25" COMPACT

Boyd Laconia, LLC

3,012 -
501603B00000G

数据表

- Tray Active Board Level TO-3 Rhombus 1.880" (47.75mm) 1.400" (35.56mm) - 1.250" (31.75mm) Bolt On 4.0W @ 30°C 3.00°C/W @ 200 LFM 7.80°C/W Aluminum Black Anodized
374724B60024G

374724B60024G

HEATSINK BGA W/O SOLDER ANCHORS

Boyd Laconia, LLC

865 -
374724B60024G

数据表

- Bulk Active Top Mount BGA Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.709" (18.00mm) Solder Anchor 3.0W @ 50°C 5.20°C/W @ 200 LFM 15.30°C/W Aluminum Black Anodized
HF35G

HF35G

HEATSINK TO-220 TAB/CLIP-ON

Boyd Laconia, LLC

1,002 -
HF35G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.380" (35.05mm) 1.102" (28.00mm) - 0.787" (19.99mm) Clip and PC Pin 2.0W @ 20°C 6.00°C/W @ 300 LFM 11.10°C/W Aluminum Black Anodized
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