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制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
574902B03700G

574902B03700G

HEATSINK TO-220 CLIP-ON/TABS

Boyd Laconia, LLC

3,339 -
574902B03700G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.375" (34.93mm) 0.860" (21.84mm) - 0.395" (10.03mm) Clip and PC Pin 2.5W @ 40°C 6.00°C/W @ 400 LFM 16.00°C/W Aluminum Black Anodized
578305B00000G

578305B00000G

HEATSINK TO-5 .75" BLACK

Boyd Laconia, LLC

617 -
578305B00000G

数据表

- Bag Active Top Mount TO-5 Rectangular, Fins 0.750" (19.05mm) 0.830" (21.08mm) 0.316" (8.03mm) ID 0.395" (10.03mm) Press Fit 1.0W @ 30°C 20.00°C/W @ 300 LFM 35.00°C/W Aluminum Black Anodized
M47059B011000G

M47059B011000G

MAX CLIP HEATSINK

Boyd Laconia, LLC

896 -
M47059B011000G

数据表

Max Clip System™ Bulk Active Board Level, Vertical TO-126, TO-220, TO-247 Rectangular, Angled Fins 0.591" (15.00mm) 0.764" (19.40mm) - 1.240" (31.50mm) Clip and PC Pin - - - Aluminum Black Anodized
591202B00000G

591202B00000G

HEATSINK TO-220 VERT/HORZ MOUNT

Boyd Laconia, LLC

3,034 -
591202B00000G

数据表

- Bag Active Board Level TO-220, TO-262 Rectangular, Fins 0.600" (15.24mm) 0.500" (12.70mm) - 0.500" (12.70mm) Clip 1.0W @ 40°C 16.00°C/W @ 200 LFM 26.80°C/W Aluminum Black Anodized
311505B00000G

311505B00000G

TO-5 PUSH-ON HEATSINK

Boyd Laconia, LLC

336 -
311505B00000G

数据表

- Bulk Active Board Level TO-5 Cylindrical - - 0.317" (8.05mm) ID, 0.375" (9.52mm) OD 0.400" (10.16mm) Press Fit 1.0W @ 70°C 45.00°C/W @ 200 LFM 90.00°C/W Aluminum Black Anodized
574902B00000G

574902B00000G

HEATSINK TO-220 CLIP-ON

Boyd Laconia, LLC

1,302 -
574902B00000G

数据表

- Bulk Active Board Level TO-220 Rectangular, Fins 1.375" (34.93mm) 0.860" (21.84mm) - 0.395" (10.03mm) Clip 2.5W @ 40°C 6.00°C/W @ 400 LFM 16.00°C/W Aluminum Black Anodized
M47079B011000G

M47079B011000G

MAX CLIP HEATSINK

Boyd Laconia, LLC

546 -
M47079B011000G

数据表

Max Clip System™ Bulk Active Board Level, Vertical TO-126, TO-220, TO-247 Rectangular, Angled Fins 0.790" (20.07mm) 0.764" (19.40mm) - 1.240" (31.50mm) Clip and PC Pin - - - Aluminum Black Anodized
7021B-MTG

7021B-MTG

HEATSINK TO-220 TAB FOLD 42.16MM

Boyd Laconia, LLC

6,795 -
7021B-MTG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.450" (36.83mm) 1.750" (44.45mm) - 0.380" (9.65mm) Bolt On and PC Pin 6.0W @ 50°C 4.00°C/W @ 300 LFM 6.80°C/W Aluminum Black Anodized
577002B04000G

577002B04000G

HEATSINK TO-220 W/TAB .25

Boyd Laconia, LLC

1,060 -
577002B04000G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.250" (6.35mm) Bolt On and PC Pin 1.5W @ 50°C 16.00°C/W @ 200 LFM 32.00°C/W Aluminum Black Anodized
573400D00000G

573400D00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

2,248 -
573400D00000G

数据表

- Bulk Active Top Mount TO-268 (D³Pak) Rectangular, Fins 0.500" (12.70mm) 1.220" (30.99mm) - 0.401" (10.20mm) SMD Pad 1.0W @ 20°C 4.00°C/W @ 600 LFM 14.00°C/W - Tin
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