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制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
7023BG

7023BG

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

3,756 -
7023BG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.950" (49.53mm) 1.900" (48.26mm) - 0.950" (24.13mm) Bolt On and PC Pin 5.0W @ 30°C 2.50°C/W @ 400 LFM 4.40°C/W Aluminum Black Anodized
6238B-MTG

6238B-MTG

BOARD LEVEL HEATSINK .61" TO-220

Boyd Laconia, LLC

1,841 -
6238B-MTG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.159" (29.44mm) 1.005" (25.53mm) - 0.610" (15.49mm) Clip and PC Pin 2.0W @ 40°C 6.00°C/W @ 600 LFM 13.60°C/W Aluminum Black Anodized
7020BG

7020BG

HEATSINK TO-220 FOLD 42.16MM

Boyd Laconia, LLC

3,664 -
7020BG

数据表

- Bulk Active Board Level TO-220 Rectangular, Fins 1.450" (36.83mm) 1.300" (33.02mm) - 0.470" (11.94mm) Bolt On 8.0W @ 70°C 4.00°C/W @ 500 LFM 8.70°C/W Aluminum Black Anodized
501403B00000G

501403B00000G

HEAT SINK TO-3 .750" COMPACT

Boyd Laconia, LLC

508 -
501403B00000G

数据表

- Bag Active Board Level TO-3 Rhombus 1.880" (47.75mm) 1.400" (35.56mm) - 0.750" (19.05mm) Bolt On 4.0W @ 40°C 3.00°C/W @ 400 LFM 10.00°C/W Aluminum Black Anodized
576802B04100G

576802B04100G

HEATSINK TO220 CLIPON W/TAB.75"

Boyd Laconia, LLC

3,004 -
576802B04100G

数据表

- Bulk Active Board Level, Vertical TO-220, TO-262 Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - 0.500" (12.70mm) Clip and PC Pin 1.0W @ 30°C 7.00°C/W @ 400 LFM 27.30°C/W Aluminum Black Anodized
593202B03500G

593202B03500G

HEATSINK TO-220 VERT MNT W/TABS

Boyd Laconia, LLC

3,613 -
593202B03500G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 2.000" (50.80mm) 1.380" (35.05mm) - 0.480" (12.19mm) Bolt On and PC Pin 6.0W @ 60°C 5.00°C/W @ 200 LFM 10.40°C/W Aluminum Black Anodized
7138DG

7138DG

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

1,381 -
7138DG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.025" (26.04mm) 1.005" (25.53mm) - 0.610" (15.49mm) Clip and PC Pin 1.5W @ 40°C 5.00°C/W @ 500 LFM 20.00°C/W Copper Tin
7024B-MTG

7024B-MTG

HEATSINK TO-220 TAB FOLD 41.15MM

Boyd Laconia, LLC

1,314 -
7024B-MTG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.620" (41.15mm) 2.000" (50.80mm) - 0.750" (19.05mm) Bolt On and PC Pin 9.0W @ 60°C 4.00°C/W @ 200 LFM 5.60°C/W Aluminum Black Anodized
500403B00000G

500403B00000G

HEATSINK TO-3 12W H=1.25" BLK

Boyd Laconia, LLC

937 -
500403B00000G

数据表

- Bag Active Board Level TO-3 Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) - 1.250" (31.75mm) Bolt On 10.0W @ 50°C 2.00°C/W @ 400 LFM 5.00°C/W Aluminum Black Anodized
647062

647062

INTEL XEON CPU COOLER 1U

Boyd Laconia, LLC

394 -
647062

数据表

- Tray Active Top Mount, Zipper Fin Intel® Xeon® CPU Rectangular, Fins 4.252" (108.00mm) 3.071" (78.00mm) - 1.004" (25.50mm) Bolt On - - - - -
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