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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
581202B02500G

581202B02500G

HEATSINK TO-220 2.5W BLK W/PINS

Boyd Laconia, LLC

833 -
581202B02500G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 2.000" (50.80mm) 0.640" (16.26mm) - 0.640" (16.26mm) Bolt On and PC Pin 1.5W @ 20°C 4.00°C/W @ 300 LFM 12.80°C/W Aluminum Black Anodized
569003B00000G

569003B00000G

COOLER FOR TO-3 20 WATTS

Boyd Laconia, LLC

647 -
569003B00000G

数据表

- Tray Active Board Level TO-3 Square, Pin Fins 1.830" (46.48mm) 1.830" (46.48mm) - 1.310" (33.27mm) Bolt On 12.0W @ 60°C 1.50°C/W @ 500 LFM 5.50°C/W Aluminum Black Anodized
342941

342941

COPPER HEATSINK 40X40.5X13.5MM

Boyd Laconia, LLC

143 -
342941

数据表

- Tray Active Top Mount, Skived BGA Square, Fins 1.594" (40.50mm) 1.575" (40.00mm) - 0.531" (13.50mm) Push Pin - 2.50°C/W @ 200 LFM 13.30°C/W Copper AavSHIELD 3C
342949

342949

COPPER HEATSINK 80X80X12MM

Boyd Laconia, LLC

161 -
342949

数据表

- Tray Active Top Mount, Skived BGA Square, Fins 3.150" (80.00mm) 3.150" (80.00mm) - 0.472" (12.00mm) Push Pin - 1.20°C/W @ 200 LFM 5.10°C/W Copper AavSHIELD 3C
783452F00000G

783452F00000G

78345 EXTRUSION 1.54X2.68"X4.1'

Boyd Laconia, LLC

281 -
783452F00000G

数据表

- Box Active Top Mount, Extrusion - Rectangular, Pin Fins 49.500" (1257.30mm) 2.677" (68.00mm) - 1.535" (39.00mm) - - 1.00°C/W @ 400 LFM - Aluminum -
574602B03700G

574602B03700G

HEATSINK TO220 VER MNT W/TAB.69"

Boyd Laconia, LLC

4,396 -
574602B03700G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.690" (17.53mm) 0.860" (21.84mm) - 0.395" (10.03mm) Clip and PC Pin 3.0W @ 60°C 6.00°C/W @ 600 LFM 21.60°C/W Aluminum Black Anodized
591202B04000G

591202B04000G

HEATSINK TO-220 CLIP-ON/TAB

Boyd Laconia, LLC

2,830 -
591202B04000G

数据表

- Bulk Active Board Level, Vertical TO-220, TO-262 Rectangular, Fins 0.600" (15.24mm) 0.500" (12.70mm) - 0.500" (12.70mm) Clip and PC Pin 1.0W @ 40°C 16.00°C/W @ 200 LFM 26.80°C/W Aluminum Black Anodized
579402B00000G

579402B00000G

HEATSINK TO-220 SNAP-DOWN .75"

Boyd Laconia, LLC

3,984 -
579402B00000G

数据表

- Bag Active Board Level TO-220 Rectangular, Fins 0.750" (19.05mm) 0.980" (24.89mm) - 0.440" (11.18mm) Clip 3.0W @ 50°C 6.00°C/W @ 500 LFM 16.80°C/W Aluminum Black Anodized
573902B04000G

573902B04000G

HEATSINK TO-220 CLIP-ON/TAB

Boyd Laconia, LLC

4,976 -
573902B04000G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.500" (38.10mm) 0.500" (12.70mm) - 0.500" (12.70mm) Clip and PC Pin 3.0W @ 60°C 7.00°C/W @ 200 LFM 18.80°C/W Aluminum Black Anodized
M48079B011000G

M48079B011000G

MAX CLIP HEATSINK

Boyd Laconia, LLC

2,967 -
M48079B011000G

数据表

Max Clip System™ Bulk Active Board Level, Vertical TO-126, TO-220, TO-247 Rectangular, Angled Fins 0.790" (20.07mm) 0.866" (22.00mm) - 1.516" (38.50mm) Clip and PC Pin - - - Aluminum Black Anodized
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