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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
507002B00000G

507002B00000G

HEATSINK TO-220 BLK

Boyd Laconia, LLC

866 -
507002B00000G

数据表

Hat Section 5070 Bag Active Board Level TO-220 Rectangular, Fins 0.700" (17.78mm) 1.750" (44.45mm) - 0.375" (9.52mm) Bolt On 2.0W @ 40°C 5.00°C/W @ 500 LFM 15.60°C/W Aluminum Black Anodized
V5618B

V5618B

HEATSINK ALUM ANOD

Assmann WSW Components

617 -
V5618B

数据表

- Bulk Active Top Mount 14-DIP and 16-DIP Rectangular, Fins 0.748" (19.00mm) 0.250" (6.35mm) - 0.189" (4.80mm) Press Fit - - 46.00°C/W Aluminum Black Anodized
634-10ABPE

634-10ABPE

HEATSINK TO-220 VERT MT BLK 1"

Wakefield-Vette

17,022 -
634-10ABPE

数据表

634 Box Active Board Level, Vertical TO-220 Rectangular, Fins 1.000" (25.40mm) 0.640" (16.26mm) - 0.640" (16.26mm) Bolt On and PC Pin - - - Aluminum Black Anodized
7141DG

7141DG

BOARD LEVEL HEATSINK .515"TO-220

Boyd Laconia, LLC

409 -
7141DG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.780" (19.81mm) 0.520" (13.21mm) - 0.515" (13.08mm) Clip and PC Pin 1.0W @ 30°C 10.00°C/W @ 200 LFM 20.30°C/W Copper Tin
V5618C

V5618C

HEATSINK ALUM ANOD

Assmann WSW Components

400 -
V5618C

数据表

- Bulk Active Top Mount 18-DIP Rectangular, Fins 0.900" (23.00mm) 0.250" (6.35mm) - 0.189" (4.80mm) Press Fit - - 40.00°C/W Aluminum Black Anodized
7-338-1PP-BA

7-338-1PP-BA

HEATSINK PWR W/PINS BLACK TO-220

CTS Thermal Management Products

375 -
7-338-1PP-BA

数据表

7 Box Active Board Level, Vertical TO-220 Rectangular, Fins 1.500" (38.10mm) 1.380" (35.05mm) - 0.500" (12.70mm) Bolt On and PC Pin 3.0W @ 40°C - 12.70°C/W Aluminum Black Anodized
647-10ABEP

647-10ABEP

HEATSINK TO-220 W/PINS BLK 1"

Wakefield-Vette

1,978 -
647-10ABEP

数据表

647 Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.650" (41.91mm) 1.000" (25.40mm) - 1.000" (25.40mm) Bolt On and PC Pin 6.0W @ 42°C 3.80°C/W @ 200 LFM - Aluminum Black Anodized
580200B00000G

580200B00000G

HEATSINK 14-16 DIP BLK ANODIZED

Boyd Laconia, LLC

1,694 -
580200B00000G

数据表

- Bag Active Top Mount 14-DIP and 16-DIP Rectangular, Fins 0.890" (22.61mm) 0.600" (15.24mm) - 0.410" (10.42mm) Press Fit, Slide On 1.0W @ 20°C 12.00°C/W @ 200 LFM 20.00°C/W Aluminum Black Anodized
HSB36-353510

HSB36-353510

HEAT SINK, BGA, 35 X 35 X 10 MM,

Same Sky (Formerly CUI Devices)

610 -
HSB36-353510

数据表

HSB Box Active Top Mount BGA Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.394" (10.00mm) Adhesive (Not Included) 5.9W @ 75°C 4.30°C/W @ 200 LFM 12.72°C/W Aluminum Alloy Black Anodized
TGH-0130-01

TGH-0130-01

ALUMINIUM HEAT SINK 13X13MM

t-Global Technology

6,817 -
TGH-0130-01

数据表

TGH Bulk Active Top Mount - Square, Fins 0.512" (13.00mm) 0.512" (13.00mm) - 0.236" (6.00mm) - - - - Aluminum Clean Anodized
628-65AB

628-65AB

HEATSINK CPU 43MM SQ BLK H=.65"

Wakefield-Vette

1,181 -
628-65AB

数据表

628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.650" (16.51mm) Thermal Tape, Adhesive (Not Included) 3.0W @ 20°C 2.00°C/W @ 400 LFM - Aluminum Black Anodized
HSB35-272725

HSB35-272725

HEAT SINK, BGA, 27 X 27 X 25 MM,

Same Sky (Formerly CUI Devices)

214 -
HSB35-272725

数据表

HSB Box Active Top Mount BGA Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.984" (25.00mm) Adhesive (Not Included) 8.6W @ 75°C 2.90°C/W @ 200 LFM 8.74°C/W Aluminum Alloy Black Anodized
574102B00000G

574102B00000G

HEATSINK TO-220 CLIP-ON BLK

Boyd Laconia, LLC

3,951 -
574102B00000G

数据表

- Bag Active Board Level TO-220 Rectangular, Fins 0.750" (19.05mm) 0.860" (21.84mm) - 0.395" (10.03mm) Clip 1.5W @ 40°C 8.00°C/W @ 500 LFM 23.20°C/W Aluminum Black Anodized
HSB19-272718

HSB19-272718

HEAT SINK, BGA, 27 X 27 X 18 MM

Same Sky (Formerly CUI Devices)

490 -
HSB19-272718

数据表

HSB Box Active Top Mount BGA Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.709" (18.00mm) Adhesive (Not Included) 6.8W @ 75°C 4.50°C/W @ 200 LFM 11.11°C/W Aluminum Alloy Black Anodized
TGH-0200-02

TGH-0200-02

ALUMINIUM HEAT SINK 20X20MM

t-Global Technology

899 -
TGH-0200-02

数据表

TGH Bulk Active Top Mount - Square, Fins 0.787" (20.00mm) 0.787" (20.00mm) - 0.236" (6.00mm) - - - - Aluminum Black Anodized
7019B-MTG

7019B-MTG

HEATSINK TO-220 TAB FOLD 25.4MM

Boyd Laconia, LLC

2,514 -
7019B-MTG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.000" (25.40mm) 1.550" (39.37mm) - 0.375" (9.52mm) Bolt On and PC Pin 3.0W @ 40°C 8.00°C/W @ 100 LFM 11.00°C/W Aluminum Black Anodized
577404B00000G

577404B00000G

HEATSINK TO-202 LOW PROFILE .5"

Boyd Laconia, LLC

5,333 -
577404B00000G

数据表

- Bag Active Board Level TO-202 Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.500" (12.70mm) Bolt On 2.0W @ 50°C 10.00°C/W @ 200 LFM 24.00°C/W Aluminum Black Anodized
634-20ABPE

634-20ABPE

HEATSINK TO-220 VERT MT BLK 2"

Wakefield-Vette

47,767 -
634-20ABPE

数据表

634 Box Active Board Level, Vertical TO-220 Rectangular, Fins 2.000" (50.80mm) 0.640" (16.26mm) - 0.640" (16.26mm) Bolt On and PC Pin - - - Aluminum Black Anodized
624-45AB

624-45AB

HEATSINK CPU 21MM SQ W/OUT ADH

Wakefield-Vette

936 -
624-45AB

数据表

624 Bulk Active Top Mount BGA Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.450" (11.43mm) Thermal Tape, Adhesive (Not Included) - 15.00°C/W @ 200 LFM - Aluminum Black Anodized
ATS015015004-SF-4C

ATS015015004-SF-4C

HEATSINK 15X15X4MM

Advanced Thermal Solutions Inc.

189 -
ATS015015004-SF-4C

数据表

- Bulk Active Top Mount BGA Square, Fins 0.591" (15.00mm) 0.590" (15.00mm) - 0.157" (4.00mm) Thermal Tape, Adhesive (Not Included) - 47.08°C/W @ 200 LFM - Aluminum Black Anodized
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