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制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
577002B00000G

577002B00000G

HEAT SINK TO-220 .250" COMPACT

Boyd Laconia, LLC

11,322 -
577002B00000G

数据表

- Bag Active Board Level TO-220 Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.250" (6.35mm) Bolt On 1.5W @ 50°C 10.00°C/W @ 500 LFM 32.00°C/W Aluminum Black Anodized
V2022B

V2022B

HEATSINK CPU XCUT

Assmann WSW Components

3,673 -
V2022B

数据表

- Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.236" (6.00mm) Thermal Tape, Adhesive (Not Included) - - 24.00°C/W Aluminum Alloy Black Anodized
240118ABHE22

240118ABHE22

HEATSINK TO-220 TWISTED FIN

Wakefield-Vette

3,195 -
240118ABHE22

数据表

240 Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.180" (29.97mm) 0.570" (14.47mm) - 0.500" (12.70mm) Bolt On and PC Pin 4.0W @ 55°C 5.30°C/W @ 400 LFM 13.80°C/W Aluminum Black Anodized
HSS-B20-NP-12

HSS-B20-NP-12

HEATSINK TO-220 6.8W ALUMINUM

Same Sky (Formerly CUI Devices)

1,157 -
HSS-B20-NP-12

数据表

HSS Bag Active Board Level TO-220 Rectangular, Fins 1.450" (36.83mm) 0.700" (17.80mm) - 0.850" (21.60mm) Bolt On 6.8W @ 75°C 3.47°C/W @ 200 LFM 14.33°C/W Aluminum Black Anodized
591302B02800G

591302B02800G

HEATSINK TO-220 W/INSTALL TAB

Boyd Laconia, LLC

27,378 -
591302B02800G

数据表

- Bulk Active Board Level, Vertical TO-220, TO-262 Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - 0.500" (12.70mm) Clip and Board Locks 1.0W @ 30°C 7.00°C/W @ 400 LFM 26.80°C/W Aluminum Black Anodized
V6560Y

V6560Y

HEATSINK ALUM ANOD

Assmann WSW Components

12,491 -
V6560Y

数据表

- Tray Active Board Level TO-220 Rectangular, Fins 1.969" (50.00mm) 1.181" (30.00mm) - 0.472" (12.00mm) Bolt On and PC Pin - - 7.00°C/W Aluminum Black Anodized
V5629W220

V5629W220

HEATSINK ALUM ANOD

Assmann WSW Components

5,741 -
V5629W220

数据表

- Bulk Active Top Mount TO-220 Square, Fins 0.984" (25.00mm) 0.449" (11.40mm) - 0.260" (6.60mm) Bolt On and PC Pin - - 36.00°C/W Aluminum Black Anodized
HSB01-080808

HSB01-080808

HEAT SINK, BGA, 8.5 X 8.5 X 8 MM

Same Sky (Formerly CUI Devices)

2,653 -
HSB01-080808

数据表

HSB Box Active Top Mount BGA Square, Pin Fins 0.335" (8.50mm) 0.335" (8.50mm) - 0.315" (8.00mm) Adhesive (Not Included) 1.9W @ 75°C 16.00°C/W @ 200 LFM 39.10°C/W Aluminum Alloy Black Anodized
V2027B

V2027B

HEATSINK CPU XCUT

Assmann WSW Components

5,084 -
V2027B

数据表

- Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 1.098" (27.90mm) 1.098" (27.90mm) - 0.441" (11.20mm) Thermal Tape, Adhesive (Not Included) - - 19.00°C/W Aluminum Alloy Black Anodized
HSB03-141406

HSB03-141406

HEAT SINK, BGA, 14 X 14 X 6 MM

Same Sky (Formerly CUI Devices)

3,329 -
HSB03-141406

数据表

HSB Box Active Top Mount BGA Square, Pin Fins 0.551" (14.00mm) 0.551" (14.00mm) - 0.236" (6.00mm) Adhesive (Not Included) 2.1W @ 75°C 15.80°C/W @ 200 LFM 35.98°C/W Aluminum Alloy Black Anodized
272-AB

272-AB

HEATSINK TO-220 SM FOOTPRINT BLK

Wakefield-Vette

2,177 -
272-AB

数据表

272 Bulk Active Board Level TO-220, TO-202 Rectangular, Fins 1.450" (36.83mm) 1.750" (44.45mm) - 0.375" (9.52mm) Bolt On and PC Pin 4.0W @ 42°C 3.60°C/W @ 400 LFM 10.50°C/W Aluminum Black Anodized
V2020B

V2020B

HEATSINK CPU XCUT

Assmann WSW Components

1,750 -
V2020B

数据表

- Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 0.551" (14.00mm) 0.551" (14.00mm) - 0.394" (10.00mm) Thermal Tape, Adhesive (Not Included) - - 27.00°C/W Aluminum Alloy Black Anodized
V8813W

V8813W

HEATSINK TO-220/TOP-3/SOT-32

Assmann WSW Components

1,426 -
V8813W

数据表

- Tray Active Board Level, Vertical SOT-32, TO-220, TOP-3 Rectangular, Fins 0.984" (25.00mm) 1.359" (34.50mm) - 0.492" (12.50mm) Bolt On and PC Pin - - 6.50°C/W Aluminum Black Anodized
HSB18-232310

HSB18-232310

HEAT SINK, BGA, 23 X 23 X 10 MM

Same Sky (Formerly CUI Devices)

4,224 -
HSB18-232310

数据表

HSB Box Active Top Mount BGA Square, Pin Fins 0.906" (23.00mm) 0.906" (23.00mm) - 0.394" (10.00mm) Adhesive (Not Included) 3.7W @ 75°C 6.80°C/W @ 200 LFM 20.41°C/W Aluminum Alloy Black Anodized
V-1100-SMD/A

V-1100-SMD/A

HEATSINK TO-263 12.70X26.20MM

Assmann WSW Components

1,855 -
V-1100-SMD/A

数据表

- Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) Rectangular, Fins 0.500" (12.70mm) 1.031" (26.20mm) - 0.390" (9.91mm) SMD Pad - - 23.00°C/W Copper Tin
HSE-B20250-040H-01

HSE-B20250-040H-01

HEAT SINK, EXTRUSION, TO-220, 25

Same Sky (Formerly CUI Devices)

1,145 -
HSE-B20250-040H-01

数据表

HSE Box Active Board Level, Vertical TO-220 Rectangular, Angled Fins 0.984" (25.00mm) 1.359" (34.50mm) - 0.492" (12.50mm) PC Pin 5.5W @ 75°C 4.44°C/W @ 200 LFM 13.64°C/W Aluminum Alloy Black Anodized
506007B00000G

506007B00000G

HEATSINK TO-3 LOW PROFILE .375"

Boyd Laconia, LLC

3,540 -
506007B00000G

数据表

- Bag Active Board Level TO-3 Rectangular, Fins 2.000" (50.80mm) 1.750" (44.45mm) - 0.375" (9.52mm) Bolt On 10.0W @ 70°C 3.00°C/W @ 400 LFM 7.00°C/W Aluminum Black Anodized
ATS-PCB1025

ATS-PCB1025

HEATSINK TO-126 BLACK

Advanced Thermal Solutions Inc.

4,414 -
ATS-PCB1025

数据表

- Bulk Active Board Level TO-126 Rectangular, Fins 0.560" (14.22mm) 0.620" (15.75mm) - 0.370" (9.40mm) Bolt On - 19.00°C/W @ 200 LFM 33.00°C/W Aluminum Black Anodized
ATS-PCB1064

ATS-PCB1064

HEATSINK TO-220 CLIP-ON BLACK

Advanced Thermal Solutions Inc.

1,471 -
ATS-PCB1064

数据表

- Bulk Active Board Level TO-220 Rectangular, Fins 0.748" (19.00mm) 0.504" (12.80mm) - 0.500" (12.70mm) Clip - 10.20°C/W @ 200 LFM 27.30°C/W Aluminum Black Anodized
HSB08-212106

HSB08-212106

HEAT SINK, BGA, 21 X 21 X 6 MM

Same Sky (Formerly CUI Devices)

1,436 -
HSB08-212106

数据表

HSB Box Active Top Mount BGA Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.236" (6.00mm) Adhesive (Not Included) 3.0W @ 75°C 9.70°C/W @ 200 LFM 25.40°C/W Aluminum Alloy Black Anodized
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