富聪科技订单满¥1000免运费
关注我们:

散热器

制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
530714B00000G

530714B00000G

HEATSINK TO-220 LIGHTWEIGHT .5"

Boyd Laconia, LLC

1,484 -
530714B00000G

数据表

- Bag Active Board Level TO-220 Rectangular, Fins 0.710" (18.03mm) 1.000" (25.40mm) - 0.500" (12.70mm) Bolt On 2.0W @ 40°C 4.00°C/W @ 700 LFM 20.30°C/W Aluminum Black Anodized
HSB30-373710

HSB30-373710

HEAT SINK, BGA, 37.4 X 37 X 10 M

Same Sky (Formerly CUI Devices)

172 -
HSB30-373710

数据表

HSB Box Active Top Mount BGA Square, Pin Fins 1.472" (37.39mm) 1.472" (37.39mm) - 0.394" (10.00mm) Push Pin 6.45W @ 75°C 4°C/W @ 200 LFM 11.63°C/W Aluminum Alloy Black Anodized
655-53AB

655-53AB

HEATSINK CPU 40.6MM SQ H=.525"

Wakefield-Vette

3,411 -
655-53AB

数据表

655 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 1.600" (40.64mm) 1.600" (40.64mm) - 0.522" (13.27mm) Thermal Tape, Adhesive (Not Included) 4.0W @ 40°C 2.00°C/W @ 400 LFM - Aluminum Black Anodized
V2030B

V2030B

HEATSINK CPU FORGED

Assmann WSW Components

564 -
V2030B

数据表

- Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.256" (6.50mm) Thermal Tape, Adhesive (Not Included) - - 6.00°C/W Aluminum Alloy Black Anodized
DV-T268-301E-TR

DV-T268-301E-TR

HEATSINK FOR TO-268

Ohmite

3,971 -
DV-T268-301E-TR

数据表

D Tape & Reel (TR) Active Top Mount TO-268 (D³Pak) Rectangular, Fins 0.500" (12.70mm) 1.580" (40.13mm) - 0.460" (11.68mm) Solderable Feet 7.0W @ 35°C 4.00°C/W @ 700 LFM - Aluminum Degreased
504222B00000G

504222B00000G

HEATSINK TO-220 PWR CLR 1.45"10W

Boyd Laconia, LLC

2,583 -
504222B00000G

数据表

- Bag Active Board Level TO-220 (Dual) Rectangular, Fins 1.450" (36.83mm) 0.780" (19.81mm) - 0.850" (21.60mm) Bolt On 4.0W @ 40°C 5.00°C/W @ 200 LFM 6.40°C/W Aluminum Black Anodized
M48118B011000G

M48118B011000G

MAX CLIP HEATSINK

Boyd Laconia, LLC

6,174 -
M48118B011000G

数据表

Max Clip System™ Bulk Active Board Level, Vertical TO-126, TO-220, TO-247 Rectangular, Angled Fins 1.180" (29.97mm) 0.866" (22.00mm) - 1.516" (38.50mm) Clip and PC Pin - - - Aluminum Black Anodized
HSB16-404018

HSB16-404018

HEAT SINK, BGA, 40 X 40 X 18 MM

Same Sky (Formerly CUI Devices)

1,049 -
HSB16-404018

数据表

HSB Box Active Top Mount BGA Square, Pin Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.709" (18.00mm) Adhesive (Not Included) 9.4W @ 75°C 2.60°C/W @ 200 LFM 7.96°C/W Aluminum Alloy Black Anodized
580100B00000G

580100B00000G

HEATSINK SLIDE-ON 8-DIP

Boyd Laconia, LLC

574 -
580100B00000G

数据表

- Bulk Active Top Mount 8-DIP Rectangular, Fins 0.562" (14.27mm) 0.600" (15.24mm) - 0.450" (11.43mm) Press Fit, Slide On 1.0W @ 30°C 8.00°C/W @ 500 LFM 30.00°C/W Aluminum Black Anodized
HSB40-252510P

HSB40-252510P

HEAT SINK, BGA, 25 X 25 X 10 MM,

Same Sky (Formerly CUI Devices)

346 -
HSB40-252510P

数据表

HSB Box Active Top Mount BGA Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.394" (10.00mm) Push Pin 4.2W @ 75°C 6.00°C/W @ 200 LFM 17.87°C/W Aluminum Alloy Black Anodized
576602B00000G

576602B00000G

HEATSINK TO-220 VERT MNT .95"

Boyd Laconia, LLC

3,037 -
576602B00000G

数据表

- Bag Active Board Level, Vertical TO-220 Rectangular, Fins 0.950" (24.13mm) 1.000" (25.40mm) - 0.500" (12.70mm) Bolt On and PC Pin 1.0W @ 20°C 9.00°C/W @ 200 LFM 16.60°C/W Aluminum Black Anodized
TGH-0220-03

TGH-0220-03

ALUMINIUM HEAT SINK 22X22MM

t-Global Technology

670 -
TGH-0220-03

数据表

TGH Bulk Active Top Mount - Square, Pin Fins 0.866" (22.00mm) 0.866" (22.00mm) - 0.354" (9.00mm) - - - - Aluminum Black Anodized
507222B00000G

507222B00000G

HEATSINK TO-220 DUAL 10W

Boyd Laconia, LLC

339 -
507222B00000G

数据表

Hat Section 5070 Bag Active Board Level TO-220 Rectangular, Fins 1.470" (37.34mm) 1.750" (44.45mm) - 0.375" (9.52mm) Bolt On 8.0W @ 70°C 3.00°C/W @ 200 LFM 9.60°C/W Aluminum Black Anodized
V4330K

V4330K

HEATSINK ANOD ALUM

Assmann WSW Components

2,003 -
V4330K

数据表

- Bulk Active Board Level KLP Rectangular, Fins 1.476" (37.50mm) 1.142" (29.00mm) - 0.472" (12.00mm) Bolt On - - 11.00°C/W Aluminum Black Anodized
E2A-T220-38E

E2A-T220-38E

BLACK ANODIZED HEATSINK

Ohmite

144 -
E2A-T220-38E

数据表

EX Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.641" (16.28mm) 0.642" (16.30mm) - 1.500" (38.10mm) Bolt On and Board Mounts 3.0W @ 50°C 5.00°C/W @ 200 LFM 14.00°C/W Aluminum Black Anodized
FA-T220-51E

FA-T220-51E

HEATSINK TO-218,TO-220,TO-247

Ohmite

1,499 -
FA-T220-51E

数据表

F Box Active Board Level, Vertical TO-218, TO-220, TO-247 Rectangular, Fins 2.000" (50.80mm) 1.638" (41.60mm) - 0.984" (25.00mm) Bolt On and PC Pin 4.0W @ 20°C 2.00°C/W @ 300 LFM 3.40°C/W Aluminum Black Anodized
V8818V

V8818V

HEATSINK ALUM ANOD

Assmann WSW Components

488 -
V8818V

数据表

- Tray Active Board Level SOT-32, TO-220 Rectangular, Fins 2.362" (60.00mm) 0.748" (19.00mm) - 0.844" (21.44mm) Bolt On and PC Pin - - 7.50°C/W Aluminum Black Anodized
658-25ABT3

658-25ABT3

HEATSINK CPU 28MM SQ BLK W/TAPE

Wakefield-Vette

3,605 -
658-25ABT3

数据表

658 Bulk Active Top Mount BGA Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.250" (6.35mm) Thermal Tape, Adhesive (Included) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Aluminum Black Anodized
HSB17-404025

HSB17-404025

HEAT SINK, BGA, 40 X 40 X 25 MM

Same Sky (Formerly CUI Devices)

596 -
HSB17-404025

数据表

HSB Box Active Top Mount BGA Square, Pin Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.984" (25.00mm) Adhesive (Not Included) 11.7W @ 75°C 2.10°C/W @ 200 LFM 6.41°C/W Aluminum Alloy Black Anodized
HSB27-434316

HSB27-434316

HEAT SINK, BGA, 43.1 X 43.1 X 16

Same Sky (Formerly CUI Devices)

916 -
HSB27-434316

数据表

HSB Box Active Top Mount BGA Square, Pin Fins 1.697" (43.10mm) 1.697" (43.10mm) - 0.650" (16.51mm) Adhesive (Not Included) 8.98W @ 75°C 2.80°C/W @ 200 LFM 8.35°C/W Aluminum Alloy Black Anodized
共 122183 条记录«上一页1... 1415161718192021...6110下一页»
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户